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OSP Surface Treatment Process Automotive PCB Board Double Sided IPC Class 3 Standard
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Solder Mask: | Green/Red/Black/Blue/White | Min. Hole Size: | 0.1mm |
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| Impedance Control: | Yes | Through-Hole Capability: | Yes |
| Surface Mount Capability: | Yes | Surface Finish: | HASL, ENIG, OSP |
| Application: | Automotive | Max Board Size: | 528 Mm X 600 Mm |
| Normal Board Thickness: | 1.6/1.2/1.0/0.8mm Or Customized | ||
| Highlight: | OSP Process Automotive PCB Board,Automotive PCB Board Double Sided,IPC Class 3 Standard Automotive PCB |
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Product Description
Double-sided OSP process
Organic protective film: The OSP layer, typically 0.1-0.3μm thick, adheres tightly to the copper surface, providing oxidation resistance without compromising the original flatness of the copper.
Double-sided application: Uniformly applied to both sides of the board, ensuring consistent protection and solderability across all exposed copper pads and traces.
Process compatibility: Works well with standard PCB substrates (such as FR-4) and integrates seamlessly into conventional manufacturing workflows, with no negative impact on solder mask materials (e.g., red, blue, or green inks).
Excellent solderability retention: The organic film is easily removed during soldering, allowing for good wetting of the copper surface by solder, reducing the risk of cold solder joints and ensuring reliable connections, even for fine-pitch components.
Cost-effectiveness: Compared to gold immersion or hot air solder leveling (HASL), the OSP process is simpler, requires fewer production steps, and has lower material costs, making it ideal for cost-sensitive applications.
Environmental friendliness: Uses non-toxic organic compounds, avoiding heavy metals (like lead or gold) in large quantities, and generates less hazardous waste, aligning with modern environmental regulations.
Thin and flat surface: The ultra-thin OSP layer does not significantly alter the board’s thickness or surface flatness, making it suitable for high-density circuit designs and applications where dimensional precision is critical.
Main Manufacturing Process Flow of Double-Sided PCB
1.Substrate Preparation:Cut the FR-4 or other dielectric substrate to the required size, and conduct surface cleaning to remove dust, oil stains and other impurities.
2.Drilling:Use CNC drilling machines to drill through holes at preset positions on the substrate for interconnection between the top and bottom copper layers.
3.PlatingThrough Hole (PTH):Deposit:a thin layer of conductive carbon or palladium on the inner wall of the holes to form a conductive base.
Perform electrolytic copper plating to thicken the copper layer on the hole walls, ensuring reliable electrical connection between the two sides of the board.
4.Dry Film Lamination & Exposure:Laminate:a photosensitive dry film on both sides of the substrate.
Place the PCB circuit film on the dry film, and use UV light for exposure. The exposed areas of the dry film will polymerize and harden, while the unexposed areas remain soluble.
5.Developing:Immerse the substrate in a developing solution to dissolve and remove the unexposed dry film, exposing the copper foil that needs to be etched.
6.Etching:Use an etching solution (such as ferric chloride or cupric chloride) to corrode the exposed copper foil, retaining only the copper circuits protected by the hardened dry film.
7.Stripping:Remove the remaining dry film from the surface of the circuit board with a stripping solution, revealing the clear copper circuit pattern.
8.Solder Mask Coating:Apply solder mask ink on both sides of the board, and expose and develop it to cover the non-welding areas. This step protects the copper circuits from oxidation and prevents short circuits during soldering.
9.Silkscreen Printing:Print component labels, part numbers, logos and other information on the solder mask surface for easy component assembly and identification.
10.Surface Finishing:Carry out surface treatment on the pad areas (such as HASL, ENIG, OSP, etc.) to improve solderability and corrosion resistance.
11.Electrical Testing:Use a flying probe tester or fixture tester to check the continuity and insulation of the circuits, ensuring that there are no open circuits, short circuits or other defects.
12.Routing & Inspection:Cut the finished circuit board into individual units according to the design requirements, and conduct a final visual inspection to confirm that the appearance and performance meet the standards.
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