1.2mm Thinkness Automotive Electronic PCB Board High Precision Customization Design
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
|---|---|
| Price: | NA |
| Delivery Time: | 14-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | Automotive Print Circuit Board | Material: | FR4 |
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| Min.line Width: | 3mil | The Min.hole: | 0.1mm |
| Minimum Line Space: | 3mil (0.075mm) | Board Thickness: | 0.2-5.0mm |
| PTH: | +/-0.075mm | Surface Finishing: | HASL/OSP/ENIG |
| Highlight: | Automotive Electronic PCB Board 1.2mm,High Precision Automotive Electronic PCB |
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Product Description
Customizable Automotive Electronic Printed Circuit Board:
Automotive PCBs are specialized printed circuit boards tailored for vehicle electronics systems, including ADAS, infotainment, powertrain controls and EV modules. Manufactured with high-TG or metal-core substrates, they withstand extreme temperatures, vibration and EMI, ensuring stable signal transmission, compact integration and reliable operation for critical automotive safety and performance functions.
Automotive PCB Key Features
| Feature | Brief Description |
| High-Temp Resistance | Withstands -40°C to 125°C for engine bay & harsh automotive environments. |
| Vibration Durability | Reinforced substrate structure resists mechanical stress from vehicle operation. |
| EMI Shielding | Minimizes electromagnetic interference to ensure stable signal transmission. |
| High Integration | Dense trace layout supports compact ADAS, infotainment & EV power systems. |
| Custom Design Flexibility | Available as rigid/flex/rigid-flex/HDI to fit curved vehicle components & high-power modules. |
| Automotive-Grade Compliance | Meets IATF 16949 standards for safety & reliability in critical vehicle functions. |
Production Requirements of Automotive Electronic PCB Board
Customers are required to provide Gerber Files and a Bill of Materials (BoM) list. These essential documents ensure that the manufacturing process is accurate and efficient, resulting in high-quality boards that meet the desired specifications.
Normally Gerber Files Included:
1.Pcb Type(Single/Double/Multi-layer/HDI)
2.Board Thickness(1.2/1.6/1.0/0.8mm)
3.Oil Ink Color(Green,Red,White,Black,Blue)
4.Surface Treatment Process(OSP,HASL,ENIG,Lead,Lead Free)
5.Solder mask requirements
6.Silkscreen requirements ect,.
Key Manufacturing Technical Challenges of Automotive PCBs
1.Extreme Environment Adaptability:Specialized substrates (high-TG FR-4, MCPCB) require optimized lamination to maintain structural and electrical stability across -40°C to 125°C, resist continuous vibration, and endure high humidity without performance loss.
2. High-Precision Trace Processing:High-resolution photolithography is needed to create ultra-fine lines/spaces (≤0.1mm) for HDI boards, with strict copper thickness control to minimize signal loss and crosstalk for ADAS and autonomous driving systems.
3. EMI/EMC Shielding Integration:Shielding layers (conductive coating, metal cladding) must be integrated into the board structure during fabrication, ensuring consistent coverage to suppress electromagnetic interference for safety-critical circuits.
4. Reliable Interlayer Connection:Blind/buried vias for multi-layer EV power PCBs demand high-precision drilling and electroplating to ensure uniform copper coverage on via walls, preventing conductivity failures from plating voids or insufficient thickness.
5. Automotive-Grade Compliance Control:Full adherence to IATF 16949 standards is mandatory, including 100% AOI for zero-defect soldering and batch thermal stability testing to verify long-term reliability for automotive use cases.
6. Flex-Rigid Hybrid Structure Fabrication:Compatible adhesives and optimized lamination parameters are required to balance bonding strength between rigid and flexible sections, preventing delamination under repeated bending for curved vehicle components.



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