• OSP Black Oil Double Panel PCB Board High Temperature Resistant for Automotive Usage
OSP Black Oil Double Panel PCB Board High Temperature Resistant for Automotive Usage

OSP Black Oil Double Panel PCB Board High Temperature Resistant for Automotive Usage

Product Details:

Place of Origin: China
Brand Name: xingqiang
Certification: ROHS, CE
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: Sample,1 pc(5 square meters)
Price: NA
Delivery Time: 7-10 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
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Detail Information

Categary: Automotive PCB Silk Screen: White
Max Board Size: 528 Mm X 600 Mm IPC Class: Class 2
RoHS Compliant: Yes Copper Thickness: 0.5-5oz
Layers: 1-30 The Min Hole: 0.1mm
Smt: Support Treatment: HASL,OSP,ENIG,Lead,Lead Free
Highlight:

Black Oil Double Panel PCB Board

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OSP PCB Board High Temperature Resistant

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Double Panel PCB Board For Automotive

Product Description

High temperature resistant OSP black oil double panel Automotive PCB

High temperature resistant OSP black oil double panel PCB is a double-sided printed circuit board integrating high temperature resistant performance, OSP (Organic Solderability Preservative) surface treatment, and a black solder mask. It adopts a double-sided wiring design: the substrate is made of high temperature resistant materials (such as high Tg FR-4), and the surface is coated with black ink as the solder mask, which provides insulation, protects the circuit, and offers good light-shielding properties. Both sides of the board undergo OSP treatment on exposed copper surfaces, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for circuits operating in high temperature environments (typically above 130℃) and adapts to the welding needs of conventional and precision components.
Core Characteristics

High temperature resistance + OSP treatment + black oil solder mask combination: The high temperature resistant substrate ensures stable performance under high heat; the ultra-thin (0.1-0.3μm) OSP film guarantees oxidation resistance and solderability; the black ink provides stable insulation, excellent light-shielding, and a professional appearance.

Double-sided structure: Supports bidirectional signal transmission, meeting the layout requirements of electronic devices working in high temperature environments and small to medium-scale circuit design needs.

Strong compatibility: The OSP process, high temperature resistant substrate, and black solder mask ink work well together, integrating smoothly into conventional production processes.


Key Advantages of Double-Sided Automotive Circuit Boards

Advantage Description Automotive Benefit
Increased Wiring Density Components can be placed and traces can run on both the top and bottom layers of the board. Allows for more complex circuitry in a smaller physical space, crucial for compact vehicle electronics.
Enhanced Functionality The higher density accommodates more components and connections, enabling more sophisticated electronic features. Supports advanced systems like ADAS (Advanced Driver-Assistance Systems), infotainment, and complex engine control units.
Cost-Effective for Complexity Offers a good balance between complexity (compared to single-sided) and cost (compared to multi-layer boards). Provides a reliable and economical solution for many mid-range complexity automotive applications.
Proven Reliability Double-sided construction is well-established and robust, especially when using through-hole technology for component attachment. Meets the demanding reliability, vibration, and temperature requirements of the automotive environment.



Double-Sided Automotive PCB Manufacturing Process

1.Design & Prototyping:Develop circuit layouts via CAD software; create prototypes for electrical performance testing.
2. Substrate Preparation:Cut automotive-grade substrates (e.g., high-TG FR-4, MCPCB) to size and clean surface impurities.
3. Circuit Imaging & Etching:Transfer PCB designs to substrates via photolithography; etch unwanted copper to form circuit traces.
4. Drilling & Plating:Drill holes for component connection; plate inner walls with copper to ensure interlayer conductivity.
5. Solder Mask & Silkscreen Printing:Apply solder mask to protect traces; print silkscreen labels for component placement guidance.
6. Component Assembly & Testing:Mount components via SMT/wave soldering; conduct electrical tests (e.g., AOI, ICT) to verify functionality and reliability for automotive environments.


Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
0%
3 stars
0%
2 stars
0%
1 stars
0%

All Reviews

B
Barbara
United States Dec 16.2025
The flexible circuit board is resistant to high and low temperatures, and it performed flawlessly during testing. There were only some minor burrs after cutting, which can be easily removed by sanding.
M
Murat
Turkey Dec 4.2025
The black oil coating reduces electromagnetic interference, resulting in stable data transmission during machine operation.
F
Fjäll
Switzerland Sep 1.2025
After vibration testing, the BGA-packaged HDI board showed microcracks in the solder joints and increased contact resistance. The manufacturer suggested increasing the spacing between ground vias and optimizing the solder joint layout. Subsequent testing showed no cracks, and the reliability was significantly improved.

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