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Custom Rigid-Flex PCB for Medical Devices – High Precision & Biocompatible Materials
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
|---|---|
| Price: | Based on Gerber Files |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | Rigid Flexible Board | Min. Solder Mask Clearance: | 0.1mm |
|---|---|---|---|
| Board Material: | FR4 | Surface Finishing: | ENIG |
| Normal Layer: | 2/4/6/8/10L | Pcba Standard: | IPC-A-610E |
| Minimum Line Space: | 3mil (0.075mm) | Material: | High Tg FR-4+PI |
| Price: | Based On Gerber Files | Board Thinkness: | 1.6/1.2/1.0/0.8mm Or Customized |
| Highlight: | 1.2mm Soft Hard Bonding PCB Board,OEM 8 Layer Rigid Flexible PCB,Blue Oil Rigid Flexible PCB |
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Product Description
What are the advantages of our custom rigid-flex PCBs?
Our custom rigid-flex PCBs integrate rigid and flexible layers into a slim, space-saving solution, perfect for wearables and compact consumer devices. With ENIG plating, PI coverlay, and 4-layer construction, it supports high-density routing, 100,000+ flex cycles, and stable signal transmission. This all-in-one design eliminates bulky cables, cuts assembly time, and offers a lightweight, durable circuit for next-gen portable electronics.
Rigid-Flex vs. Traditional Solutions
| Key Factor | Standard PCBs | Cables/Wires | Rigid-Flex |
|---|---|---|---|
| Design Freedom | 2D Only | Loose & Messy | ✅ 3D Capability |
| Reliability | Many Connectors | Prone to Breakage | ✅ One-Piece Design |
| Space & Weight | Bulky | Adds Bulk | ✅ Ultra-Thin & Light |
| Assembly Time | Slow | Time-Consuming | ✅ Fast & Easy |
Custom Rigid-Flex PCB Manufacturing Process:
1.Design & Engineering
◦ Receive your Gerber files and specifications.
◦ Our engineers perform a DFM (Design for Manufacturability) check to optimize the design for production.
2. Material Preparation
◦ Select high-quality FR-4 (for rigid parts) and Polyimide (PI) (for flexible parts) materials.
◦ Cut the materials to the required panel size.
3. Circuit Layer Fabrication
◦ Rigid Layers: Process FR-4 cores with copper cladding, drilling, and plating.
◦ Flex Layers: Process PI films, apply adhesive (or use adhesive-less material), and form the circuit traces.
4. Layer Stack-up & Lamination
◦ Stack the rigid and flexible layers together with prepreg (bonding material).
◦ Use high temperature and pressure to press (laminate) them into a single, unified board.
5. Drilling & Plating
◦ Drill holes for vias (connections between layers).
◦ Perform PTH (Plated Through-Hole) process to make the holes conductive, electrically connecting all layers.
6. Outer Layer Processing
◦ Image the outer circuits and etch away excess copper.
◦ Apply solder mask (the green/blue/black coating) to protect the board.
7. Surface Finish
◦ Apply the chosen surface treatment, such as ENIG (Immersion Gold) or HASL, to ensure excellent solderability.
8. Coverlay Application (Flex Area)
◦ Apply a protective PI coverlay (instead of solder mask) on the flexible regions to allow bending.
9. Profile Routing & Depaneling
◦ Use a router or laser to cut the board to its final shape.
◦ Remove excess material and separate individual PCBs.
10. Electrical Testing & Quality Control
◦ Perform 100% E-Test to check for short circuits or open circuits.
◦ Inspect for defects (AOI - Automated Optical Inspection).
11. Packaging & Shipping
◦ Package the finished PCBs in anti-static bags.
◦ Ship them to your location.
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