6 Layer HDI Printed Circuit Boards Thick Copper Clad Design Custom Size
Place of Origin:
China
Brand Name:
xingqiang
Certification:
ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number:
As Per Customer's Model
Minimum Order Quantity:
Sample,1 pc(5 square meters)
Price:
Based on Gerber Files
Delivery Time:
NA
Payment Terms:
,T/T,Western Union
Supply Ability:
100000㎡/Month
Product Details
Highlight:
1.2mm Thick Copper Clad PCB Board
,6 Layer HDI Printed Circuit Boards
Product:
HDI Printed Circuit Boards
Min Hole Size:
0.1mm
Material:
High Tg FR-4
Minimum Line Space:
3mil (0.075mm)
Pcba Standard:
IPC-A-610E
Surface Treament:
OSP/ENIG/ ENEPIG
Special Thick:
2.0/0.6/0.4/0.2
THT/SMT:
SMD, BGA, DIP, Etc.
Normal Board Thinkness:
1.6/1.2/1.0/0.8mm
Production Files:
Gerber Files/BOM(Pcba)
Product Description
1.6-layer HDI Thick Copper Board PCB
HDI PCB, short for High-Density Interconnect Printed Circuit Board, is a high-precision circuit board that adopts microvias (blind vias, buried vias, stacked vias, etc.), fine conductors (usually line width/space ≤ 4mil/4mil) and advanced lamination technology. Its core feature is to achieve higher circuit density and component integration within a limited board space, which can meet the development needs of electronic devices for "miniaturization, lightweight, and high performance". It is widely used in fields such as 5G communications, medical imaging, smart wearables, automotive electronics, and aerospace. Compared with traditional PCBs, HDI PCBs can significantly reduce the board size (usually by 25%-40%) by reducing the diameter of vias and optimizing the interlayer connection method, while improving signal transmission speed and stability, and reducing electromagnetic interference.
3.Industry-Specific Applications
- 5G & Telecommunications: 5G small cells, base station transceivers, and optical modules—handles high-frequency signals (sub-6GHz/mmWave) without interference.
- Medical Equipment: MRI scanners, portable ECG monitors, and dental imaging devices—medical-grade materials ensure biocompatibility and compliance with ISO 13485.
- Automotive Electronics: ADAS (Advanced Driver Assistance Systems), in-vehicle infotainment, and EV battery management—resists vibration (10-2000Hz) and humidity (85℃/85%RH, 1000h).
- Aerospace & Defense: UAV (drone) flight controllers, satellite communication modules—meets MIL-STD-202G for shock, temperature, and altitude resistance.
4. Material & Reliability
| Material/Standard | Specification | Advantage for Global Buyers |
|---|---|---|
| Base Substrate | FR-4 (Tg 170-220℃) / High-Tg PI (for high-temperature scenarios) | Withstands -55℃~150℃ operating temperature; compatible with lead-free soldering (260℃ peak) |
| Copper Foil | 0.5oz~3oz (electrodeposited/rolled) | Ensures low resistance (≤0.003Ω/sq) for high-current applications (e.g., automotive power modules) |
| Surface Finish | ENIG (Immersion Gold: 3-5μm Au) / OSP / HASL | ENIG provides 1000+ contact cycles (ideal for connectors)；OSP suits low-cost, high-volume consumer electronics |
Factory showcase
PCB Quality Testing
Certificates and Honors
Overall Rating
5 star
100%
4 star
0
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1 star
0
All Reviews
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FAfter vibration testing, the BGA-packaged HDI board showed microcracks in the solder joints and increased contact resistance. The manufacturer suggested increasing the spacing between ground vias and optimizing the solder joint layout. Subsequent testing showed no cracks, and the reliability was significantly improved.
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OThis smartwatch uses a 6-layer HDI (High-Density Interconnect) circuit board, which is 30% smaller than traditional 4-layer boards. It also integrates navigation and sensing modules, and the lightweight design reduces the device's weight by 12g, resulting in an additional 8 minutes of battery life.
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