• 8 Layer Rigid Flex PCB High Density Wiring FR4 Material Versatile Usage
8 Layer Rigid Flex PCB High Density Wiring FR4 Material Versatile Usage

8 Layer Rigid Flex PCB High Density Wiring FR4 Material Versatile Usage

Product Details:

Place of Origin: China
Brand Name: xingqiang
Certification: ROHS, CE
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: Sample,1 pc(5 square meters)
Price: NA
Delivery Time: 15-16 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 3000㎡
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Detail Information

Min. Solder Mask Clearance: 0.1mm Pcba Standard: IPC-A-610E
Aspect Ratio: 20:1 Board Thinkness: Customized
Minimum Line Space: 3mil (0.075mm) Surface Finishing: HASL/OSP/ENIG
Materila: FR4 Quotation Request: Gerber File And Bom List
Highlight:

Black Oil Rigid Flex PCB

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Soft And Hard Combination Plate PCB

Product Description

Black oil 8-layer blue oil soft hard bonding board PCB

  Black oil 8-layer soft and hard combination plate PCB is a printed circuit board that combines the characteristics of rigid PCB and flexible PCB. It combines rigid PCB and flexible PCB designs to create a circuit board that has the structural strength of a rigid board with the flexibility of a flexible board. Rigid-flex PCB can achieve more circuit connection options, and also has high mechanical strength and good flexibility, which is suitable for application scenarios that require the advantages of both rigidity and flexibility.



product Features:

  • Rigidity and flexibility combined 
  • Space saving
  • High-density wiring
  • Good seismic and anti-interference performance
  • Improve the reliability of the system
  • Design flexibility


Manufacturing process:

  • Design and material selection: During the design phase, it is necessary to clarify which parts need to be rigid and which parts need to be flexible. App base materials (such as FR4, polyimide) and processes should be selected to ensure good integration of rigid and flexible parts..
  • PCB lamination: The manufacturing of rigid-flex PCBs requires the lamination of rigid and flexible parts, which usually involves precise hot pressing and bonding to combine different material circuit layers into a complete PCB.
  • Surface treatment: Surface treatment processes (such as gold plating, tin plating, OSP, etc.) are used to protect the surface of the circuit, ensuring its good solderability and anti-oxidation capability.
  • Assembly and testing: After completing the circuit board, perform component placement or plug-in welding, and conduct electrical testing to ensure that the circuit functions normally and the design requirements.

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