Custom Rigid-Flex PCB for Medical Devices – High Precision & Biocompatible Materials

What are the advantages of our custom rigid-flex PCBs?

Our custom rigid-flex PCBs integrate rigid and flexible layers into a slim, space-saving solution, perfect for wearables and compact consumer devices. With ENIG plating, PI coverlay, and 4-layer construction, it supports high-density routing, 100,000+ flex cycles, and stable signal transmission. This all-in-one design eliminates bulky cables, cuts assembly time, and offers a lightweight, durable circuit for next-gen portable electronics.

Rigid-Flex vs. Traditional Solutions

Custom Rigid-Flex PCB Manufacturing Process:

1.Design & Engineering
◦ Receive your Gerber files and specifications.
◦ Our engineers perform a DFM (Design for Manufacturability) check to optimize the design for production.
2. Material Preparation
◦ Select high-quality FR-4 (for rigid parts) and Polyimide (PI) (for flexible parts) materials.
◦ Cut the materials to the required panel size.
3. Circuit Layer Fabrication
◦ Rigid Layers: Process FR-4 cores with copper cladding, drilling, and plating.
◦ Flex Layers: Process PI films, apply adhesive (or use adhesive-less material), and form the circuit traces.
4. Layer Stack-up & Lamination
◦ Stack the rigid and flexible layers together with prepreg (bonding material).
◦ Use high temperature and pressure to press (laminate) them into a single, unified board.
5. Drilling & Plating
◦ Drill holes for vias (connections between layers).
◦ Perform PTH (Plated Through-Hole) process to make the holes conductive, electrically connecting all layers.
6. Outer Layer Processing
◦ Image the outer circuits and etch away excess copper.
◦ Apply solder mask (the green/blue/black coating) to protect the board.
7. Surface Finish
◦ Apply the chosen surface treatment, such as ENIG (Immersion Gold) or HASL, to ensure excellent solderability.
8. Coverlay Application (Flex Area)
◦ Apply a protective PI coverlay (instead of solder mask) on the flexible regions to allow bending.
9. Profile Routing & Depaneling
◦ Use a router or laser to cut the board to its final shape.
◦ Remove excess material and separate individual PCBs.
10. Electrical Testing & Quality Control
◦ Perform 100% E-Test to check for short circuits or open circuits.
◦ Inspect for defects (AOI - Automated Optical Inspection).
11. Packaging & Shipping
◦ Package the finished PCBs in anti-static bags.
◦ Ship them to your location.

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