DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for High Density Applications
Brand Name:
Xingqiang
Certification:
ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number:
As Per Customer's Model
Minimum Order Quantity:
Sample,1 Pc(5 Square Meters)
Price:
Based on Gerber Files
Delivery Time:
NA
Payment Terms:
,T/T,Western Union
Supply Ability:
100000㎡/Month
Product Details
Highlight:
flexible circuit board gold finish
,DIY bendable PI substrate PCB
,robotics flexible circuit board
PCB Name:
Hard And Soft Board
Min Hole Size:
0.1mm
Routing:
+/-0.1mm
Copper Overall:
0.5-5oz
Pcba Service:
Support
Docunment Format:
Gerber,Pcb
Regular Layer:
1-30L Or 30+
Pcb Standard:
IPC-A-610 E Class II
Quote Requirement:
Gerber File And Bom List
Board Finished:
Sinking Gold,HASL,OSP
Pcb Test:
Flying Probe Test, E-test, Etc.
Aperture Tolerance:
PTH ±0.075, NTPH ±0.05
Product Description
DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics
Our Customization Capabilities
We specialize in customized flexible printed circuit boards (FPCs) and rigid-flex PCBs, offering complete structural solutions from 2 layers to multiple layers. Our core advantages include using highly flexible polyimide substrates combined with high-end surface treatments such as electroless nickel immersion gold (ENIG), ensuring oxidation resistance and durability of solder joints. We support small-batch rapid prototyping and large-scale mass production, providing highly reliable flexible interconnection solutions for consumer electronics, automotive electronics, industrial equipment, and other applications.
Circuit Board Advantages
| High Density | The multilayer design allows for high component density, making it suitable for complex electronic systems. |
|---|---|
| Reliability | The combination of rigid and flexible sections enhances durability and reliability, especially in dynamic environments. |
| Thermal Management | Multiple layers can be designed to improve heat dissipation and manage thermal performance. |
| Solderability | The tin-spray finish ensures good solderability and protects the copper traces from oxidation. |
Technical Challenges in Rigid-Flex PCB Manufacturing
Flexible Section Challenges
- Material fragility: Thin, flexible substrates require specialized handling (e.g., carrier boards for horizontal processing) to prevent damage or misalignment.
- Chemical sensitivity: Polyimide materials are incompatible with strong alkalis, necessitating adjusted process parameters for desmearing and blackening.
- Lamination stability: Flexible layers exhibit poor dimensional stability, requiring controlled lamination conditions and specialized padding materials (e.g., polypropylene films) to ensure adhesion.
Rigid Section Challenges
- Stress management: Inconsistent glass fabric orientation and thermal stress during pressing can cause warping or delamination.
- Dimensional control: Shrinkage/expansion variations in flexible materials demand pre-compensation in rigid section fabrication.
- Via processing: Flexible layer window machining requires precise timing and parameter control to balance weld integrity and foldability.
Integration Challenges
- Layer alignment: Hybrid FPC/PCB production necessitates precise registration between flexible and rigid layers, often using OPE-punched tooling.
- Quality control: High-value assemblies require 100% inspection due to complex process flows and low yield rates.
- Process integration: Conflicting requirements between flexible (e.g., NOFLOW prepregs) and rigid (e.g., standard FR-4) materials complicate lamination and drilling.
Factory Showcase
PCB Quality Testing
Certificates and Honors
Overall Rating
5 star
100%
4 star
0
3 star
0
2 star
0
1 star
0
All Reviews
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IThe product has excellent welding compatibility, and we will continue to cooperate in the long term.
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IThe through-holes are of excellent quality, with no blockages and thick copper plating on the hole walls.
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