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4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 12-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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| Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
| Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
| Materila: | FR4 | Product: | Print Circuit Board |
| Highlight: | Custom Size 4 Layer PCB Board,FR4 Solderable 4 Layer PCB Board |
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Product Description
FR4 solderable 4-layer board PCB
Product Description:
Multilayer printed circuit boards (PCB) are a common type of circuit board in modern electronic devices. They consist of multiple single-sided or double-sided circuit boards stacked together with insulating materials in between, forming a single unit. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.
Advantages of Multilayer PCB:
- High Density
- Improved Signal Integrity
- Better Electromagnetic Compatibility (EMC)
- Adapt to high-frequency applications
- Better thermal management
- Complexity and Cost
Applications:
• Telecommunications
• Computers
• Automotive electronics
• Medical devices
• Consumer electronics
• Aerospace
• Industrial control
Manufacturing process:
- Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
- Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
- Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
- Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
- Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).
