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Green Oil Solderable PCB Board HASL/OSP/ENIG Treatment Customized Services
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
|---|---|
| Price: | Based on Gerber Files |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | Multi-layer Print Circuit Board | Pcba Standard: | IPC-A-610E |
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| Min Hole Size: | 0.1mm | Minimum Line Space: | 3mil (0.075mm) |
| Surface Finishing: | HASL/OSP/ENIG | Material: | FR4 |
| Normal Layers: | 2/4/6/8/10 Layers | Fabrication: | Gerber Or BOM List |
| Silkscreen Color: | White,Black,Yellow,Red | Board Thinkness: | 1.6/1.2/1.0/0.8 Or Customized |
| Highlight: | Custom Size 4 Layer PCB Board,FR4 Solderable 4 Layer PCB Board |
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Product Description
How are multi-layer circuit boards made?
Multilayer printed circuit boards (PCBs) are one of the most prevalent circuit board types in contemporary electronic devices. They are constructed by stacking multiple single-sided or double-sided circuit substrates, with insulating dielectric materials sandwiched between each layer to form an integrated unit. Each tier features distinct circuit traces, and these layers are electrically interconnected via conductive vias and interlayer wiring.
Advantages of Multilayer PCBs vs. Single/Double-sided PCBs
| Comparison Aspect | Multilayer PCBs | Single/Double-sided PCBs |
|---|---|---|
| Space Utilization | High-density wiring in compact footprint | Limited wiring space; bulky for complex circuits |
| Circuit Complexity | Supports sophisticated, multi-functional designs | Only suitable for simple circuit layouts |
| Signal Integrity | Better impedance control; reduced signal interference | Poor anti-interference ability; signal distortion risk |
| Product Miniaturization | Enables smaller, lighter electronic devices | Restricts miniaturization of high-performance products |
Manufacturing Process of Multilayer PCBs (Concise English Points)
1. Inner-layer Core Preparation: Cut the copper-clad laminate into core boards, then conduct pattern transfer, etching, and stripping to form inner-layer circuit patterns.
2. AOI Inspection: Perform automated optical inspection on inner-layer boards to detect defects like residual copper, open circuits, or short circuits.
3. Layer Stacking & Lamination: Stack inner-layer boards with prepreg (bonding material) alternately, then press under high temperature and pressure to form an integrated multilayer core.
4. Drilling: Drill through vias, blind vias, or buried vias at designated positions to establish interlayer connections.
5. Plating: Conduct copper plating on via walls and board surfaces to ensure reliable electrical conductivity between layers.
6. Outer-layer Processing: Repeat pattern transfer, etching, and stripping steps on the outer layers to form external circuit traces.
7. Surface Finishing: Apply surface treatments such as HASL, ENIG, or immersion tin to protect copper and enhance solderability.
8. Final Testing & Shaping: Carry out electrical testing (e.g., flying probe test) and dimension cutting, then inspect for overall quality before packaging.
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