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FR4 Material Flex Rigid PCB Board With HASL or ENIG Surface Treament
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 15-16 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Pcb Type: | Rigid-Flex PCB | Layer Count: | 1-30L |
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| Samples: | Available | Test: | 100% E-Test |
| Base Material: | FR-4/High TG | Surface Finish: | HASL, ENIG, OSP |
| Drawing File Format: | Gerber File,BOM | PCB Standard: | IPC-A-610 E Class II |
| Normal Thickness: | 1.6/1.2/1.0/0.8mm Or Customized | Ink Color: | Green/Red/White/Blue/Black/Yellow |
| Highlight: | Altium Flex Rigid PCB Board,Immersion Silver Flex Rigid PCB Board,40um Accuracy Flex Rigid PCB |
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Product Description
FR4 Flame Retardant Rigid-Flex PCB
The flex-rigid board combines the structural stability of rigid substrates with the bending flexibility of flexible materials, suiting 3D assembly in tight spaces. It boasts excellent insulation and temperature resistance, withstands repeated mechanical stress, and ensures stable circuitry. Widely used in smart devices, automotive electronics, etc., it aids lightweight and highly reliable device designs.
Advantages of Rigid-Flex PCB:
- Optimize space and size
- Reduce the use of connectors and cables
- Adapt to complex spatial layout
- High temperature resistance and chemical resistance
Why Choose Us?
✔ 30 Years Expertise in PCB Manufacturing
✔ ISO 9001, ROHS, and ISO /TS16949 Certified
✔ Support customized services(PCB,PCBA)
✔ Professional Engineering Support (DFM, impedance simulation)
✔ Global Shipping (DHL, FedEx, UPS) – Delivered to USA, Germany, UK, Japan, Australia, etc.
Custom Rigid-Flex PCB Manufacturing Process:
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Material Preparation:Select tailored rigid substrates (e.g., FR-4) and flexible materials (e.g., polyimide film) based on customer specs, then cut them into standard sizes.
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Circuit Pattern Fabrication:Apply photoresist to substrates, transfer the designed circuit pattern via exposure and development, then etch away excess copper to form precise conductive traces.
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Flexible Section :ProcessingCover flexible circuit areas with coverlay (protective polyimide layer) and punch holes for component mounting and interconnection.
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Lamination & Bonding:Stack rigid and flexible sections in the preset order, use heat and pressure to bond them firmly with adhesive films, forming the integrated rigid-flex structure.
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Drilling & Plating:Drill via holes for electrical connection between layers, then plate the holes with copper to ensure conductivity across rigid and flexible parts.
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Solder Mask & Silkscreen Printing:Apply solder mask to protect circuits from oxidation and short circuits; print component labels and alignment marks on the board surface.
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Electrical Testing:Conduct 100% electrical performance tests (e.g., continuity, insulation resistance) to verify compliance with design standards.
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Final Shaping & Inspection:Cut the board into the final customer-required shape, perform visual inspection for defects, then package and deliver.
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