• DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics
DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics

DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics

Product Details:

Brand Name: Xingqiang
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number: Varies By Goods Condition

Payment & Shipping Terms:

Minimum Order Quantity: Sample,1 Pc(5 Square Meters)
Price: Based on Gerber Files
Delivery Time: NA
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
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Detail Information
PCB Name: Hard And Soft Board Min Hole Size: 0.1mm
Routing: +/-0.1mm Copper Overall: 0.5-5oz
Pcba Service: Support Docunment Format: Gerber,Pcb
Regular Layer: 1-30L Or 30+ Pcb Standard: IPC-A-610 E Class II
Quote Requirement: Gerber File And Bom List Board Finished: Sinking Gold,HASL,OSP
Pcb Test: Flying Probe Test, E-test, Etc. Aperture Tolerance: PTH ±0.075, NTPH ±0.05
Highlight:

8 layer rigid flex PCB

,

HASL surface treatment PCB

,

custom size FR4 PCB

Product Description

What we can do? :

We specialize in customized flexible printed circuit boards (FPCs) and rigid-flex PCBs, offering complete structural solutions from 2 layers to multiple layers.  Our core advantages include: using highly flexible polyimide substrates, combined with high-end surface treatments such as electroless nickel immersion gold (ENIG), ensuring oxidation resistance and durability of solder joints; supporting small-batch rapid prototyping and large-scale mass production, providing highly reliable flexible interconnection solutions for consumer electronics, automotive electronics, industrial equipment, and other applications.



Our circuit board's advantages:

High Density The multilayer design allows for high component density, making it suitable for complex electronic systems.
Reliability The combination of rigid and flexible sections enhances durability and reliability, especially in dynamic environments.
Thermal Management  Multiple layers can be designed to improve heat dissipation and manage thermal performance.
Solderability The tin-spray finish ensures good solderability and protects the copper traces from oxidation.



Difficulties in making rigid-flex PCBs:

     1.Flexible Section Challenges Material fragility: Thin, flexible substrates require specialized handling (e.g., carrier boards for horizontal           processing) to prevent damage or misalignment .    
     2.Chemical sensitivity: Polyimide materials are incompatible with strong alkalis, necessitating adjusted process parameters for desmearing and blackening .  
     3.Lamination stability: Flexible layers exhibit poor dimensional stability, requiring controlled lamination conditions and specialized padding materials (e.g.,polypropylene films) to ensure adhesion . 
     4. Rigid Section Challenges  Stress management: Inconsistent glass fabric orientation and thermal stress during pressing can cause warping or delamination .   
     5.Dimensional control:Shrinkage/expansion variations in flexible materials demand pre-compensation in rigid section fabrication .  
     6.Via processing: Flexible layer window machining requires precise timing and parameter control to balance weld integrity and foldability .
     7.Integration Challenges Layer alignment: Hybrid FPC/PCB production necessitates precise registration between flexible and rigid layers, often using OPE- punched tooling .  
     8.Quality control: High-value assemblies require 100% inspection due to complex process flows and low yield rates .  
     9.Process integration: Conflicting requirements between flexible (e.g., NOFLOW prepregs) and rigid (e.g., standard FR-4) materials complicate lamination and drilling .


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          Factory showcase

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            PCB Quality Testing


DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics 2


    Certificates and Honors

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DIY Flexible Circuit Board with Gold Finish Bendable PI Substrate for Robotics 4


Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
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All Reviews

H
HASL/OSP/ENIG Surface Process PCBA for Industrial Automation FR4 SMT Assembly
Denmark Jan 5.2026
trustpilot.com
Helpful (3)
The price is very reasonable for the quality provided. We compared several suppliers, and this one offers the best value for money.
H
High Density Interconnect PCB Green Oil Solder Mask Miniaturization Design
French Guiana Nov 17.2025
Helpful (5)
The green solder mask and white lettering are clear, and the AOI inspection efficiency has increased by 40%.
C
Customizable Board Thinkness PCB FR4 Multilayer Design HASL Treatment
Mongolia Sep 27.2025
Helpful (8)
The resin-filled vias and tin-plating combination process is excellent! The vias are completely filled without any voids, and the surface tin plating is smooth and free of bumps. When mounting BGA chips, the fit is perfect, and there are no solder bridges or cold joints after soldering, meeting the requirements for high-density packaging.

Tag:

Rigid Flexible PCB

Flexible Rigid PCB

Rigid Flex Printed Circuit Board

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