Flexible printed circuit boards with high design freedom

Flexible Printed Circuit Board (FPCB) A bendable circuit board fabricated on flexible insulating substrates (e.g., polyimide PI or polyester PET), replacing traditional rigid fiberglass materials. Copper traces are etched onto the substrate through photolithography, enabling dynamic 3D interconnections for electronic components.

• Dynamic Flexibility Repeatable bending/folding (radius down to 0.1mm), adaptable to non-planar installations.
• Ultra-Thin Profile Thickness typically 0.4mm for rigid PCBs), reducing weight by 60%-70%.
• High-Density Wiring Supports micro-traces (line width/spacing ≤50μm) for enhanced integration.
• Environmental Resistance Withstands extreme temperatures (-200°C to +300°C), chemicals, and moisture.
• Mechanical Endurance Sustains >1 million bending cycles (e.g., smartphone hinge applications).

1. Space Optimization:Saves 30%-50% internal space by replacing wire harnesses (critical for foldable phones).
2. System Reliability:Reduces failure points by 25% (validated in automotive sensors).
3. Design Freedom:Enables 3D routing for complex geometries (e.g., smartwatch curves, endoscopic coils).
4. Production Efficiency:Roll-to-Roll manufacturing cuts mass-production costs (e.g., thin-film solar cells).
5. Signal Integrity:Low dielectric constant (Dk≈3.5) minimizes high-frequency loss (key for 5G mmWave antennas).

• Consumer Electronics: Foldable phones (Samsung Galaxy Fold hinges), TWS earphone batteries, VR headset joints.
• Automotive: Flexible display backlights, BMS modules, engine sensors (high-temp/vibration resistant).
• Medical Devices: Wearable biosensors, endoscope imaging units, implantable neurostimulators.
• Industrial/Aerospace: Robotic arm wiring, satellite solar array deployment circuits.
• Emerging Fields: Flexible OLED lighting, e-textiles (smart clothing), stretchable bioelectronics.

1. Substrate Prep: PI films (e.g., DuPont Kapton®) laminated with copper foil (RA/ED copper).
2. Patterning: Laser drilling (≤50μm holes) → Photoresist coating → UV exposure → Etching.
3. Coverlay Lamination: Protective film bonded via thermocompression, exposing pads (±25μm accuracy).
4. Surface Finish: ENIG or hard gold plating for solderability/wear resistance.
5. Testing & Forming: Flying probe testing → Laser cutting → Dynamic flex testing (simulating lifecycle).