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Multi Layer Structure High Density PCB Board Customized Design For Precise Communication
Product Details:
| Brand Name: | High Density PCB |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 15-17 work days |
| Payment Terms: | T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Min. Solder Mask Clearance: | 0.1mm | Count: | 1-30 Layer |
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| Cooper Thickness: | 2oz Out Layer , 1oz Inner Layer | Surface Finish: | HASL, ENIG, OSP |
| Layer Count: | 1-30 | Minimum Via Dia: | 0.2mm |
| Impedance Control: | ±10% | Board Thickness: | 0.2-5.0mm |
| Board Size: | Customizable | ||
| Highlight: | Multi Layer Structure High Density PCB,HASL Surface 8 Layer HD PCB |
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Product Description
HD PCBs with Different Surface Treatment Processes are Available.:
High Density PCBs (Printed Circuit Boards), or HDPCBs, are advanced circuit boards characterized by high component density, fine line widths/spacings (typically ≤ 0.1mm), small via sizes (e.g., microvias ≤ 0.15mm), and multi-layer structures. Their core advantage lies in enabling miniaturization, high performance, and reliabilityof electronic devices—making them indispensable in industries where space constraints, signal integrity, and functional complexity are critical.Features:
1.Ultra-fine traces: Line widths/spacings ≤ 0.1mm (even down to 0.03mm), fitting more conductive paths in limited space.2. Microvias: Tiny holes (≤0.15mm diameter) in blind/buried/stacked designs, connecting layers without wasting surface area.
3. Multi-layer structure: 8–40+ layers (vs. 2–4 for traditional PCBs) to isolate signals/power and integrate complex circuits.
4. High component density: ≥100 components per square inch, enabling mini devices (e.g., smartwatches) with rich functions.
5. Specialized materials: High-Tg FR-4 (heat-resistant), polyimide (flexible), or PTFE (low signal loss) for harsh environments/high frequencies.
6. Strict precision: Tight tolerances (e.g., ±5% line width error, ≤0.01mm layer alignment) to avoid defects in fine structures.
7. Advanced component compatibility: Supports fine-pitch BGA, CSP, and PoP packages, maximizing vertical/horizontal space use.
Applications:
| Sector | Use Cases | HDI Advantage |
|---|---|---|
| Consumer | Smartphones, AR/VR headsets | 50% size reduction vs. conventional PCBs |
| AI/Computing | GPU accelerators, server GPUs | Supports 25 Tbps/mm² interconnect |
| Medical | Endoscopic capsules, hearing aids | Reliability in 50 GHz) for signal integrity validation. |
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