Custom High Density PCB Board 4/6 Layers FR-4 Material Tailored for Mini Bluetooth Devices
Double Sided PCB Board 1.2mm Think
,Green Oil Half Hole Plate PCB Board
Professional Custom HDI PCB ISO/IPC Certificated:
Professional custom high-density interconnect PCB engineered for Bluetooth headset control modules. Featuring 4/6-layer FR-4 base, BGA compatibility and ENIG plating, our tailor-made boards offer exceptional signal integrity, anti-interference and long-term reliability. ISO/IPC compliant, fully customizable specs to fit miniaturized wireless audio applications.
Why Choose Us:
✔ 30 Years’ Rigid-Flex & HDI PCB Expertise
✔ ISO 9001/RoHS/ISO/TS16949 Certified Quality
✔ Custom 4/6-Layer FR-4 HDI Boards | ENIG | BGA Ready
✔ DFM & Impedance Simulation Engineering Support
✔ Global Express Shipping (DHL/FedEx/UPS) to US, EU, JP & AU
Custom HDI Advantages:
| Category | Key Advantages |
|---|---|
| Performance | Stable RF signal, strong anti-interference, low signal loss |
| Design | HDI microvias, BGA compatible, compact size, high wiring density |
| Quality | ENIG finish, anti-oxidation, IPC/ISO certified, long-term reliability |
| Customization | 4/6-layer FR-4, flexible specs, low MOQ for prototyping |
| Service | DFM/impedance support, fast turnaround, global express shipping |
| Assembly | Excellent solderability, ideal for SMT/BGA assembly |
| Cost | Cost-effective mass production, reduced rework rate |
Production Process:
1.Requirement Confirmation & Gerber Audit: Review customer Gerber files, BOM and technical inquiries; finalize all custom specifications including layer count, base material, ENIG surface finish, BGA layout, and HDI micro/blind/buried via requirements.
2. DFM Analysis & RF Impedance Simulation: Conduct professional Design for Manufacturability (DFM) check and impedance simulation.
3. Material Preparation & HDI Inner Layer Production: Prepare qualified FR‑4 raw materials and fabricate HDI inner layers with precise imaging, etching, and AOI inspection.
4. Multilayer Lamination & Outer Layer Processing: Perform layer lamination for 4/6-layer boards, followed by outer layer imaging, etching, and desmear processing.
5. ENIG Surface Treatment & Profile Milling: Apply ENIG (Electroless Nickel Immersion Gold) surface finish for better solderability and oxidation resistance; rout the board to custom outline and dimensions.
6. Electrical & Reliability Verification: Run electrical continuity/insulation test, impedance test, flying probe test, and reliability checks to meet IPC and customer quality standards.
7. Final Inspection, Packaging & Global Delivery: Complete final visual and dimensional inspection, conduct ESD‑safe packaging, and arrange global express shipment via DHL/FedEx/UPS.
Factory showcase
PCB Quality Testing
Certificates and Honors
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ÉThese high-density double-sided panels have been operating in a high-humidity environment for two months, and their electrical performance remains stable, with no leakage or signal drift.
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PCompared to previous suppliers, this batch of HDI boards shows significant improvements in precision and stability, with a higher yield rate, and overall satisfaction is high.
