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12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB
Product Details:
| Brand Name: | High Density PCB |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | Based on Gerber Files |
| Packaging Details: | As per Customer's Request |
| Delivery Time: | NA |
| Payment Terms: | T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | Custom High Density PCB | Min. Hole Size: | 0.1mm |
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| DK: | 4.2–4.6 | PCB Count: | 1to 30 Layers |
| Max Board Size: | 528*600mm | Min. Line Width/Spacing: | 3Mil/0.075mm |
| Material: | High-TG FR-4 | Testing Service: | 100% Testing |
| Price: | Based On Gerber Files | Solder Mask Color: | Yellow/Black/Red/White/Green/Blue |
| Surface Treament: | ENIG/ENEPIG/OSP/HASL/Lead-free HASL | Panel Thick: | Normal 1.6/1.2/1.0/0.8Mm,Special 2.0/0.6/0.4/0.2mm |
| Highlight: | Sinking Gold High Density PCB,Multiple Layers HD Printed Circuit Board |
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Product Description
Tired of Generic PCBs? Upgrade to Xingqiang’s Custom High-Density PCB Solutions:
Xingqiang Circuit Technology specializes in custom PCBs like these high density boards. Our proprietary black solder mask and gold-plated transmission lines are engineered for superior RF performance, while our flexible manufacturing allows quick iterations and low-to-high volume production. Whether for communication or industrial applications, we deliver precision-engineered, corrosion-resistant PCBs that align perfectly with your unique design requirements.
HDI PCB Core Technologies & Functional Advantages:
1.Microvias:
• Description: Small vias (typically in diameter) created by laser drilling. They are crucial for connecting layers in a high-density environment.
• Function: Enables high connection density and complex routing in a small area.
2. Blind and Buried Vias:
• Description: Vias that do not pass through the entire board (blind) or only connect internal layers (buried).
• Function: Saves valuable surface space and internal routing area compared to traditional through-holes.
3. Finer Lines and Spaces:
• Description: The trace width and the space between traces are significantly reduced, often to .
• Function: Allows for more traces to be routed in a given area, increasing the density.
4. Higher Component Density:
• Description: Due to the fine pitch features and microvias, more components (especially high pin count devices like BGAs) can be placed and connected on a smaller board footprint.
• Function: Essential for modern portable and high-performance electronic devices (e.g., smartphones, wearables).
Get Your HD Boards: Critical Manufacturing Files List:
• Gerber Files (RS‑274X): Core layer artwork files defining traces, pads, solder mask, silkscreen and fine circuit patterns.
• Layer Stack‑Up Drawing: Defines dielectric thickness, copper weight and layer sequence for HDI construction.
• BOM (Bill of Materials): Lists all electronic components, specifications and quantities for assembly.
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