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12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB

Brand Name: High Density PCB
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number: As Per Customer's Model
Minimum Order Quantity: Sample,1 pc(5 square meters)
Price: Based on Gerber Files
Standard Packaging: As per Customer's Request
Delivery Time: NA
Payment Terms: T/T,Western Union
Supply Ability: 100000㎡/Month
Product Details
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Sinking Gold High Density PCB

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Multiple Layers HD Printed Circuit Board

Product: Custom High Density PCB
Min. Hole Size: 0.1mm
DK: 4.2–4.6
PCB Count: 1to 30 Layers
Max Board Size: 528*600mm
Min. Line Width/Spacing: 3Mil/0.075mm
Material: High-TG FR-4
Testing Service: 100% Testing
Price: Based On Gerber Files
Solder Mask Color: Yellow/Black/Red/White/Green/Blue
Surface Treament: ENIG/ENEPIG/OSP/HASL/Lead-free HASL
Panel Thick: Normal 1.6/1.2/1.0/0.8Mm,Special 2.0/0.6/0.4/0.2mm
Product Description

Tired of Generic PCBs? Upgrade to Xingqiang’s Custom High-Density PCB Solutions:

Xingqiang Circuit Technology specializes in custom PCBs like these high density boards. Our proprietary black solder mask and gold-plated transmission lines are engineered for superior RF performance, while our flexible manufacturing allows quick iterations and low-to-high volume production. Whether for communication or industrial applications, we deliver precision-engineered, corrosion-resistant PCBs that align perfectly with your unique design requirements.


HDI PCB Core Technologies & Functional Advantages:

1.Microvias:
• Description: Small vias (typically  in diameter) created by laser drilling. They are crucial for connecting layers in a high-density environment.
• Function: Enables high connection density and complex routing in a small area.
2. Blind and Buried Vias:
• Description: Vias that do not pass through the entire board (blind) or only connect internal layers (buried).
• Function: Saves valuable surface space and internal routing area compared to traditional through-holes.
3. Finer Lines and Spaces:
• Description: The trace width and the space between traces are significantly reduced, often to .
• Function: Allows for more traces to be routed in a given area, increasing the density.
4. Higher Component Density:
• Description: Due to the fine pitch features and microvias, more components (especially high pin count devices like BGAs) can be placed and connected on a smaller board footprint.
• Function: Essential for modern portable and high-performance electronic devices (e.g., smartphones, wearables).


Get Your HD Boards: Critical Manufacturing Files List:

• Gerber Files (RS‑274X): Core layer artwork files defining traces, pads, solder mask, silkscreen and fine circuit patterns.
• Layer Stack‑Up Drawing: Defines dielectric thickness, copper weight and layer sequence for HDI construction.
• BOM (Bill of Materials): Lists all electronic components, specifications and quantities for assembly.


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          Factory showcase

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            PCB Quality Testing


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    Certificates and Honors

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Overall Rating
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All Reviews
  • I
    Isis
    Egypt Apr 9.2026 trustpilot.com
    ★★★★★
    ★★★★★
    The matte black solder resist has a very high-quality feel, with rounded edges that won't cut your hands, and the hole walls are smooth and shiny with a metallic finish.
  • R
    Roy
    Canada Feb 4.2026 trustpilot.com
    ★★★★★
    ★★★★★
    The sheet material has good moisture resistance and can support three-proof processes, making it suitable for complex outdoor flight environments such as rain, humidity, and dust.
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