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12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB

Brand Name: High Density PCB
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number: As Per Customer's Model
Minimum Order Quantity: Sample,1 pc(5 square meters)
Price: Based on Gerber Files
Standard Packaging: As per Customer's Request
Delivery Time: NA
Payment Terms: T/T,Western Union
Supply Ability: 100000㎡/Month
Product Details
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Sinking Gold High Density PCB

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Multiple Layers HD Printed Circuit Board

Product: Custom High Density PCB
Min. Hole Size: 0.1mm
DK: 4.2–4.6
PCB Count: 1to 30 Layers
Max Board Size: 528*600mm
Min. Line Width/Spacing: 3Mil/0.075mm
Material: High-TG FR-4
Testing Service: 100% Testing
Price: Based On Gerber Files
Solder Mask Color: Yellow/Black/Red/White/Green/Blue
Surface Treament: ENIG/ENEPIG/OSP/HASL/Lead-free HASL
Panel Thick: Normal 1.6/1.2/1.0/0.8Mm,Special 2.0/0.6/0.4/0.2mm
Product Description

Tired of Generic PCBs? Upgrade to Xingqiang’s Custom High-Density PCB Solutions:

Xingqiang Circuit Technology specializes in custom PCBs like these high density boards. Our proprietary black solder mask and gold-plated transmission lines are engineered for superior RF performance, while our flexible manufacturing allows quick iterations and low-to-high volume production. Whether for communication or industrial applications, we deliver precision-engineered, corrosion-resistant PCBs that align perfectly with your unique design requirements.


HDI PCB Core Technologies & Functional Advantages:

1.Microvias:
• Description: Small vias (typically  in diameter) created by laser drilling. They are crucial for connecting layers in a high-density environment.
• Function: Enables high connection density and complex routing in a small area.
2. Blind and Buried Vias:
• Description: Vias that do not pass through the entire board (blind) or only connect internal layers (buried).
• Function: Saves valuable surface space and internal routing area compared to traditional through-holes.
3. Finer Lines and Spaces:
• Description: The trace width and the space between traces are significantly reduced, often to .
• Function: Allows for more traces to be routed in a given area, increasing the density.
4. Higher Component Density:
• Description: Due to the fine pitch features and microvias, more components (especially high pin count devices like BGAs) can be placed and connected on a smaller board footprint.
• Function: Essential for modern portable and high-performance electronic devices (e.g., smartphones, wearables).


Get Your HD Boards: Critical Manufacturing Files List:

• Gerber Files (RS‑274X): Core layer artwork files defining traces, pads, solder mask, silkscreen and fine circuit patterns.
• Layer Stack‑Up Drawing: Defines dielectric thickness, copper weight and layer sequence for HDI construction.
• BOM (Bill of Materials): Lists all electronic components, specifications and quantities for assembly.


12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB

         

          Factory showcase

12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB


            PCB Quality Testing


12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB


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12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB



12 Layers Sinking Gold High Density PCB Withstands Vibration for Custom UAV PCB

 

Overall Rating
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All Reviews
  • I
    Isis
    Egypt Apr 9.2026 trustpilot.com
    ★★★★★
    ★★★★★
    The matte black solder resist has a very high-quality feel, with rounded edges that won't cut your hands, and the hole walls are smooth and shiny with a metallic finish.
  • R
    Roy
    Canada Feb 4.2026 trustpilot.com
    ★★★★★
    ★★★★★
    The sheet material has good moisture resistance and can support three-proof processes, making it suitable for complex outdoor flight environments such as rain, humidity, and dust.
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