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Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules
Brand Name:
High Density PCB
Certification:
ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Model Number:
As Per Customer's Model
Minimum Order Quantity:
Sample,1 pc(5 square meters)
Price:
Based on Gerber Files
Delivery Time:
NA
Payment Terms:
T/T,Western Union
Supply Ability:
100000㎡/Month
Product Details
Highlight:
Multi Layer Structure High Density PCB
,HASL Surface 8 Layer HD PCB
PCB Type:
Custom High Density PCB
High-Tg FR-4:
Yes
Min Line Spacing:
3Mil
Impedance Control:
±10%
DFM Review:
Support
Board Thickness:
0.2-5.0mm
Layer Count:
1-30 Layers
Board Size:
As Your Request
Surface Finish:
HASL, ENIG, OSP
Price:
Gerber Files Or BOM List
Hole Size Tolerance:
PTH ±0.075, NTPH ±0.05
Product Features:
High Density,Low-Dk Substrate,Moisture Proof
Product Description
What can we do?:
We offer custom high-density HD PCBs.Built with fine traces, laser microvias, and multilayer designs, they support device miniaturization and high-speed signal integrity. Available with ENIG/OSP/HASL surface finishes, impedance control, and reliable FR‑4 or low-loss substrates. All PCBs are IPC compliant, anti-static vacuum packed, and fully tailored to your Gerber, layer count, and performance specifications.Custom PCB vs. Off-the-Shelf PCB:
| Comparison Item | Custom High-Density PCBs | Off-the-Shelf (Standard) PCBs |
|---|---|---|
| Design Flexibility | Fully customized to your exact dimensions, layer count, and component layout; supports HDI/microvia/miniaturization | Fixed size, layout, and features; limited to standard specifications |
| Performance Matching | Optimized for high-speed, impedance control, low loss, or RF/5G applications | Generic performance; hard to meet high-frequency or specialized signal needs |
| Device Integration | Enables compact, slim form factors for wearables, IoT, and portable electronics | Bulky standard outlines; poor fit for miniaturized products |
| Material & Surface Finish | Choice of FR‑4, high-Tg, or low-loss substrates; ENIG/OSP/HASL selectable | Predefined materials and finishes; no customization |
| Quality & Compliance | Built to IPC Class 2, RoHS, UL per project requirements | Limited certification options; inconsistent quality |
| Long-Term Cost | Higher upfront tooling, lower assembly and maintenance costs | Lower initial cost; higher retrofitting and compatibility costs |
| Scalability | Scalable from prototypes to mass production with consistent quality | Limited scalability; frequent design compromises |
Factory showcase
PCB Quality Testing
Certificates and Honors
Overall Rating
5 star
100%
4 star
0
3 star
0
2 star
0
1 star
0
All Reviews
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SThe copper foil peel strength is very high. After repeated manual soldering and component removal, the pads remained firmly attached to the substrate without any peeling.
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RThe product is manufactured using a lead-free and environmentally friendly process, meeting industry environmental control standards. Inspection reports can be provided for each batch, and the company has complete qualifications, making project registration very convenient.
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Why Choose This High-Density PCB?: 1.Ultra-high integration & miniaturization – Fine traces, laser microvias, and blind/buried vias maximize wiring in limited space.2. Superior signal integrity – Impedance controlled, low-loss design ideal for high-speed/RF/wireless applications.3. Excellent reliability – High-Tg/thermal stable substrates and ENIG finish ensure durability and consistent performance.4. Fully customizable – Tailored layers, materials, and finishes to match your
