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Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules
Product Details:
| Brand Name: | High Density PCB |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | Based on Gerber Files |
| Delivery Time: | NA |
| Payment Terms: | T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| PCB Type: | Custom High Density PCB | High-Tg FR-4: | Yes |
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| Min Line Spacing: | 3Mil | Impedance Control: | ±10% |
| DFM Review: | Support | Board Thickness: | 0.2-5.0mm |
| Layer Count: | 1-30 Layers | Board Size: | As Your Request |
| Surface Finish: | HASL, ENIG, OSP | Price: | Gerber Files Or BOM List |
| Hole Size Tolerance: | PTH ±0.075, NTPH ±0.05 | Product Features: | High Density,Low-Dk Substrate,Moisture Proof |
| Highlight: | Multi Layer Structure High Density PCB,HASL Surface 8 Layer HD PCB |
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Product Description
What can we do?:
We offer custom high-density HD PCBs.Built with fine traces, laser microvias, and multilayer designs, they support device miniaturization and high-speed signal integrity. Available with ENIG/OSP/HASL surface finishes, impedance control, and reliable FR‑4 or low-loss substrates. All PCBs are IPC compliant, anti-static vacuum packed, and fully tailored to your Gerber, layer count, and performance specifications.Custom PCB vs. Off-the-Shelf PCB:
| Comparison Item | Custom High-Density PCBs | Off-the-Shelf (Standard) PCBs |
|---|---|---|
| Design Flexibility | Fully customized to your exact dimensions, layer count, and component layout; supports HDI/microvia/miniaturization | Fixed size, layout, and features; limited to standard specifications |
| Performance Matching | Optimized for high-speed, impedance control, low loss, or RF/5G applications | Generic performance; hard to meet high-frequency or specialized signal needs |
| Device Integration | Enables compact, slim form factors for wearables, IoT, and portable electronics | Bulky standard outlines; poor fit for miniaturized products |
| Material & Surface Finish | Choice of FR‑4, high-Tg, or low-loss substrates; ENIG/OSP/HASL selectable | Predefined materials and finishes; no customization |
| Quality & Compliance | Built to IPC Class 2, RoHS, UL per project requirements | Limited certification options; inconsistent quality |
| Long-Term Cost | Higher upfront tooling, lower assembly and maintenance costs | Lower initial cost; higher retrofitting and compatibility costs |
| Scalability | Scalable from prototypes to mass production with consistent quality | Limited scalability; frequent design compromises |
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