Low Loss BT Circuit Board BT Resin PCB Thin Design For Electronic Equipment

BT Sheet PCB

Advantages of BT Sheet  PCB:

• High temperature stability
• Low loss
• Suitable for high-density wiring
• Slim design
• Chemical corrosion resistance
• Good reliability

product  Description:

   BT resin PCB (BT Resin PCB) refers to a thin printed circuit board using BT resin (Bismaleimide-Triazine) as a compensation material. BT resin is a high-performance epoxy resin composite material with excellent thermal stability, electrical properties and mechanical strength. It is widely recognized in circuit boards that require high-temperature stability and high performance. BT thin sheet PCB is characterized by its thin design, heat transfer performance and high-density thin profile capability, making it suitable for high-end electronic equipment, especially in applications that require thinness and high performance.

product Features:

• Excellent thermal stability
• Lower dielectric constant and loss factor
• Thin design
• High mechanical strength
• Good chemical resistance
• Higher voltage withstand capability

Manufacturing process:

• Preparation of BT resin prepreg: Firstly, BT resin is mixed with reinforcing materials (such as glass fiber) to make prepreg. Pre is the key raw material for making BT thin plate PCB, ensuring uniform distribution of resin and interlayer bonding strength.
• Lamination process: The prepreg is laminated into the substrate layer of the PCB using hot pressing and high-temperature curing processes. Since the curing of BT resin is relatively high, precise control of temperature and pressure is required during lamination to ensure the stability of the substrate.
• Precision etching: After the substrate lamination is completed, the photolithography and etching processes are carried out for the circuit lines. Unwanted layers are removed by chemical etching to form the paths of the circuit.
• Hole and conductivity: Drill holes on the PCB and electroplate them to ensure good conductivity on the inner walls of the holes. Techniques such as holes, blind holes, and buried holes are often used in high-density wiring designs.
• Surface treatment: Surface treatment is performed on the surface of the PCB to improve solderability and anti-oxidation capability. Common surface treatments include gold pl, tin plating, OSP, etc.
• Assembly and testing: After the completion of PCB manufacturing, surface mounting or plug-in of components is carried out, and necessary electrical tests are performed to ensure the performance of the PCB meets the design requirements.