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1-3oz Copper Double Sided PCB Printed Circuit Board With Black Oil Sinking Gold Process
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
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Detail Information |
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| Min. Solder Mask Bridge: | 0.08mm | Max. Panel Size: | 528x600mm |
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| Surface Finish: | HASL, ENIG, OSP | Layer Count: | 2-30 Layers |
| Min. Trace/Spacing: | 3mil | Copper Thickness: | 1-3oz |
| Solder Mask Color: | Green, Blue, Red, Black, White | Min. Silkscreen Text Height: | 0.8mm |
| Min. Hole Size: | 0.1mm | Board Thickness: | 0.2-5.0mm |
| Min. Solder Mask Clearance: | 0.1mm | Silkscreen Color: | White, Black, Yellow |
| Material: | FR-4 | ||
| Highlight: | 3oz Copper Double Sided PCB,Black Oil Double Sided Circuit Board |
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Product Description
Product Description, Advantages and Characteristics of Double-Sided Gold Immersion Circuit Board
Product Description
Double-sided gold immersion circuit board is a type of printed circuit board where a uniform gold layer is formed on both sides of the substrate through a chemical deposition process. Its surface treatment process is as follows: first, a thin nickel layer is deposited as the base, and then a dense gold layer is covered on the nickel layer. The thickness of the gold layer is controllable (usually 0.05-0.1μm), the overall surface is flat and smooth, and both sides have consistent plating performance. The circuit board adopts a double-sided wiring design, which can meet the signal transmission needs of small and medium complexity circuits and is suitable for the welding and assembly of various precision components.
Core Characteristics
- Double-sided gold immersion treatment: Both sides of the substrate are covered with a nickel-gold composite coating. The gold layer is uniform, dense, has strong adhesion, and the surface flatness is high, with no obvious unevenness or pinholes.
- Double-sided wiring structure: It provides basic double-sided circuit layout space, supports two-way signal transmission, and adapts to the circuit design needs of standard electronic equipment.
- Chemical deposition process: The coating is formed by an electroless method without an external power supply. The uniformity of the coating thickness is better than that of the traditional electroplating process, making it suitable for the treatment of precision circuit areas.
Main Advantages
- Excellent solderability and stability: The gold layer has good conductivity and strong oxidation resistance, which can maintain good welding performance for a long time. It is especially suitable for high-frequency welding or the welding of precision components (such as BGA, QFP), reducing the risk of cold solder joints and false welding.
- Excellent corrosion resistance and wear resistance: The nickel layer and gold layer form double protection, which can resist the influence of complex environments such as humidity, high temperature, and chemical corrosion, and extend the service life and storage period of the circuit board (room temperature storage can reach more than 12 months).
- Suitable for high-frequency and precision scenarios: The flat gold layer surface can reduce signal transmission loss, improve the stability of high-frequency signals, and is suitable for fields with high requirements for signal quality such as communication equipment and medical instruments.
- Strong process compatibility: The gold immersion process has good adaptability to the size and line density of the circuit board, can match a variety of substrates (such as FR-4), and the production process is more environmentally friendly than some lead-containing processes, meeting the environmental protection requirements of modern electronic manufacturing.
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