• Double Sided Sunken Gold Process BT PCB Printed Circuit Board For Electronics Device
Double Sided Sunken Gold Process BT PCB Printed Circuit Board For Electronics Device

Double Sided Sunken Gold Process BT PCB Printed Circuit Board For Electronics Device

Product Details:

Place of Origin: China
Brand Name: xingqiang
Certification: ROHS, CE
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: 5 square meters
Price: NA
Delivery Time: 7-10 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 3000
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Detail Information

Min. Solder Mask Clearance: 0.1mm Pcba Standard: IPC-A-610E
Aspect Ratio: 20:1 Board Thinkness: 1.2mm
Minimum Line Space: 3mil (0.075mm) Surface Finishing: HASL/OSP/ENIG
Materila: FR4 Product: Print Circuit Board
Highlight:

Sunken Gold Process BT PCB

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BT PCB For Electronics Device

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Double Sided BT Printed Circuit Board

Product Description

Double-sided sunken gold process


product Features:

  • Two-sided wiring
  • through hole connection
  • component placement
  • Higher circuit density


product  Description:

    Double-sided sunken gold process, also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional density of the circuit board, allowing it to implement more circuit connections in a relatively small area.


Advantages of Double-sided PCB:

  • Increase the wiring space
  • Improve the circuit functional density 
  • The cost is relatively low 
  • Good electrical performance
  • Adapt to high integration requirements

Manufacturing process:

  • Design and layout:Firstly, the PCB design is carried out through circuit design software, with wiring and component placement on both sides, and the position type of vias are planned at the same time.
  • Drilling and electroplating: Drilling is carried out according to the design requirements, and electroplating is performed after drilling to form a via the circuits on both sides.
  • Etching: Remove the excess copper foil to form the desired circuit pattern.
  • Assembly and welding: After the components are installed, welding treatment is carried out, which can be done using surface-mount technology (SMT) or through technology (THT).


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