OSP Surface Flexible PCB Board 2 Layer 40mmx200mm For Medical Equipment

Product Description:

A Flexible Printed Circuit Board (FPC), also known as a flexible circuit, is a specialized type of printed circuit board constructed from flexible, bendable insulating substrates. Unlike rigid PCBs (RPCBs) that rely on inflexible materials like fiberglass-reinforced epoxy (FR-4), FPCs leverage malleable substrates to enable dynamic shaping, folding, or rolling—making them ideal for electronic devices where space constraints, weight reduction, or mechanical flexibility are critical.

 

Features:

• Product Name: Flexible PCB Board
• Size: Customized
• Application: Electronic Devices, Medical Equipment, Automotive Industry
• Mini Line Width: 0.075mm
• Standard: IPC Standard
• Layer Count: 2-30 layer

 

Technical Parameters:

Technical Parameter	Specification
Dimension	41.55*131mm
Insulation Materials	Organic Resin
Board Type	Flexiable PCB
Service	One Stop Turnkey Service
Flexibility	Highly Flexible
Application	Electronic Devices, Medical Equipment, Automotive Industry
Mini Line Width	0.075mm
Surface Treatment	OSP
Process	Immersion Gold
Legend Color	White

 

Applications:

• Consumer Electronics:Smartphones (display/touchscreen connections, camera modules), tablets, laptops (keyboard/trackpad links), smartwatches, earbuds, and gaming controllers.
• Automotive Electronics:Infotainment systems, dashboard displays, LED lighting, sensor connections (e.g., for ADAS—Advanced Driver Assistance Systems), and battery management systems (BMS).
• Medical Devices:Flexible endoscopes, wearable health monitors (e.g., heart rate sensors), implantable devices (e.g., pacemakers), and diagnostic equipment (e.g., ultrasound probes).
• Aerospace & Defense:Satellite components, avionics (e.g., cockpit displays), and military gear (where vibration resistance and compactness are critical).
• Industrial Equipment:Robotic arms (flexible connections for moving parts), industrial sensors, and control panels.

 Future Trends
• High-Density Interconnects (HDIs):Smaller vias and finer trace widths (down to 25μm) to support more complex circuits in tiny spaces.
• Eco-Friendly Materials:Development of recyclable or biodegradable substrates to reduce environmental impact.
• Integration with Sensors:Embedding flexible sensors (e.g., pressure, temperature) directly into FPCs for smart textiles, medical wearables, and IoT devices.
• 5G & High-Speed Signals:Optimized FPC designs to minimize signal loss for 5G-enabled devices and high-frequency applications (e.g., radar systems).