OEM FR4 Solder Masked Multilayer PCB Board 6 Layer Through Hole PCB

 FR4 solder-masked 6-layer board PCB

Advantages of Multilayer PCB:

• Increase circuit board density
• Reduce size
• Better signal integrity
• Adapt to high-frequency applications
• better thermal management
• Higher reliability

product Features:

• Multi-layer design
• Inner layer and outer layer
•  through hole
• Copper layer
• Dielectric layer (dielectric material)

Manufacturing process:

• Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
• Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
• Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
• Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
•  Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).