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6 Layer HDI Printed Circuit Boards Thick Copper Clad Design Custom Size
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
|---|---|
| Price: | NA |
| Delivery Time: | 14-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | HDI Printed Circuit Boards | Min Hole Size: | 0.1mm |
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| Material: | FR4 | Minimum Line Space: | 3mil (0.075mm) |
| Pcba Standard: | IPC-A-610E | Surface Treament: | OSP/ENIG/HASL |
| Special Thick: | 2.0/0.6/0.4/0.2 | THT/SMT: | SMD, BGA, DIP, Etc. |
| Normal Board Thinkness: | 1.6/1.2/1.0/0.8mm | Production Files: | Gerber Files/BOM(Pcba) |
| Highlight: | 1.2mm Thick Copper Clad PCB Board,6 Layer HDI Printed Circuit Boards |
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Product Description
1.6-layer HDI Thick Copper Board PCB
HDI PCB, short for High-Density Interconnect Printed Circuit Board, is a high-precision circuit board that adopts microvias (blind vias, buried vias, stacked vias, etc.), fine conductors (usually line width/space ≤ 4mil/4mil) and advanced lamination technology. Its core feature is to achieve higher circuit density and component integration within a limited board space, which can meet the development needs of electronic devices for "miniaturization, lightweight, and high performance". It is widely used in fields such as 5G communications, medical imaging, smart wearables, automotive electronics, and aerospace. Compared with traditional PCBs, HDI PCBs can significantly reduce the board size (usually by 25%-40%) by reducing the diameter of vias and optimizing the interlayer connection method, while improving signal transmission speed and stability, and reducing electromagnetic interference.
3.Industry-Specific Applications
- 5G & Telecommunications: 5G small cells, base station transceivers, and optical modules—handles high-frequency signals (sub-6GHz/mmWave) without interference.
- Medical Equipment: MRI scanners, portable ECG monitors, and dental imaging devices—medical-grade materials ensure biocompatibility and compliance with ISO 13485.
- Automotive Electronics: ADAS (Advanced Driver Assistance Systems), in-vehicle infotainment, and EV battery management—resists vibration (10-2000Hz) and humidity (85℃/85%RH, 1000h).
- Aerospace & Defense: UAV (drone) flight controllers, satellite communication modules—meets MIL-STD-202G for shock, temperature, and altitude resistance.
4. Material & Reliability
| Material/Standard | Specification | Advantage for Global Buyers |
|---|---|---|
| Base Substrate | FR-4 (Tg 170-220℃) / High-Tg PI (for high-temperature scenarios) | Withstands -55℃~150℃ operating temperature; compatible with lead-free soldering (260℃ peak) |
| Copper Foil | 0.5oz~3oz (electrodeposited/rolled) | Ensures low resistance (≤0.003Ω/sq) for high-current applications (e.g., automotive power modules) |
| Surface Finish | ENIG (Immersion Gold: 3-5μm Au) / OSP / HASL | ENIG provides 1000+ contact cycles (ideal for connectors)；OSP suits low-cost, high-volume consumer electronics |
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