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Custom 8-Layer HDI PCB RoHS Certified ENIG Surface Treatment FR4 RoHS Certified Board
Product Details:
| Brand Name: | Xingqiang |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | Varies By Goods Condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
|---|---|
| Price: | Based on Gerber Files |
| Packaging Details: | Carton Or As Your Request |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product Name: | Custom HDI PCB | Impedance Control: | Yes |
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| Layer: | 1-30 Layers | Pcba: | Support |
| Board Size: | Customized | Surface Mount Technology: | QFN, BGA,DIP |
| Surface Finish: | HASL, ENIG, OSP | Silkscreen: | White, Black, Yellow |
| Quotation: | Gerber Files Or BOM List | Solder Mask: | Green, Red, Blue, Black, White,Yellow |
| Highlight: | medical PCB with green oil mask,customizable medical printed circuit board,medical PCB soder mask |
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Product Description
What can we do for you?:
We provide professional custom HDI PCB manufacturing for mobile and smart device manufacturers. Our 6–10 layer boards use high-Tg FR4 substrate and ENIG surface treatment for enhanced reliability and performance. With strict AOI, electrical testing, and quality control, we ensure consistent production. Compliant with international certifications, we offer DFM analysis, rapid prototyping, and mass production to meet your project requirements.
Technical Parameter:
| Parameter | Details |
|---|---|
| PCB Type | Custom HDI Multilayer PCB |
| Base Material | High-Tg FR4 (Tg ≥ 140°C) |
| Surface Finish | ENIG (Immersion Gold) |
| Layer Count | 6-10 Layers (Standard: 8L) |
| Copper Thickness | 1oz (Inner), 1oz (Outer) |
| Via Technology | Microvias, Blind & Buried Vias |
| Line Width/Spacing | 3mil / 3mil (Fine Pitch Capability) |
| Certifications | RoHS, ISO 9001 |
| Application | Custom Smartphone Mainboards, Portable Terminals |
How can we start your project?:
• Complete Gerber files including circuit layers, outline, solder mask and silkscreen
• Standard NC drill files for all via and hole data
• BOM list with component specifications if assembly is required
• Schematic diagram for engineering reference
• Clear requirements: layer count, surface finish, thickness, tolerance and IPC standard
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