Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise Communication

Product Description:

High Density PCBs (Printed Circuit Boards), or HDPCBs, are advanced circuit boards characterized by high component density, fine line widths/spacings (typically ≤ 0.1mm), small via sizes (e.g., microvias ≤ 0.15mm), and multi-layer structures. Their core advantage lies in enabling miniaturization, high performance, and reliabilityof electronic devices—making them indispensable in industries where space constraints, signal integrity, and functional complexity are critical. 

Features:

1.Ultra-fine traces: Line widths/spacings ≤ 0.1mm (even down to 0.03mm), fitting more conductive paths in limited space.
2. Microvias: Tiny holes (≤0.15mm diameter) in blind/buried/stacked designs, connecting layers without wasting surface area.
3. Multi-layer structure: 8–40+ layers (vs. 2–4 for traditional PCBs) to isolate signals/power and integrate complex circuits.
4. High component density: ≥100 components per square inch, enabling mini devices (e.g., smartwatches) with rich functions.
5. Specialized materials: High-Tg FR-4 (heat-resistant), polyimide (flexible), or PTFE (low signal loss) for harsh environments/high frequencies.
6. Strict precision: Tight tolerances (e.g., ±5% line width error, ≤0.01mm layer alignment) to avoid defects in fine structures.
7. Advanced component compatibility: Supports fine-pitch BGA, CSP, and PoP packages, maximizing vertical/horizontal space use.

Applications:

Sector	Use Cases	HDI Advantage
Consumer	Smartphones, AR/VR headsets	50% size reduction vs. conventional PCBs
AI/Computing	GPU accelerators, server GPUs	Supports 25 Tbps/mm² interconnect
Medical	Endoscopic capsules, hearing aids	Reliability in 50 GHz) for signal integrity validation.

 

HD PCB development trend in 2025

 3D Heterogeneous Integration

• Chiplet Ecosystems: Hybrid bonding (e.g., TSMC’s CoWoS-L) with 8µm line/space for NVIDIA/AMD GPU substrates.
• Silicon Interposers: TSV density >50k vias/mm², slashing signal delay by 30% in AI servers.
• Embedded Actives: Bare dies integrated into PCB layers (e.g., Medtronic’s neural implants).