HD 12 Layer PCB Board High Density Circuit Board 1.2mm Thickness Customized Size
Product Details:
Brand Name: | High Density PCB |
Certification: | ROHS, CE |
Model Number: | Varies by goods condition |
Payment & Shipping Terms:
Minimum Order Quantity: | 5 square meters |
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Price: | NA |
Delivery Time: | 7-10 work days |
Payment Terms: | T/T,Western Union |
Supply Ability: | 3000㎡ |
Detail Information |
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Surface Finish: | HASL, ENIG, OSP | Min Holes: | 0.1mm |
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Min. Order Quantity: | 5㎡ | Count: | 8 Layer |
Minimum Via Dia: | 0.2mm | Impedance Control: | ±10% |
Thickness: | 1.2mm | Layer: | 12L |
Highlight: | HD 12 Layer PCB Board,12 Layer High Density Circuit Board,1.2mm Thickness HD PCB Board |
Product Description
Product Description:
High Density PCBs (Printed Circuit Boards), or HDPCBs, are advanced circuit boards characterized by high component density, fine line widths/spacings (typically ≤ 0.1mm), small via sizes (e.g., microvias ≤ 0.15mm), and multi-layer structures. Their core advantage lies in enabling miniaturization, high performance, and reliabilityof electronic devices—making them indispensable in industries where space constraints, signal integrity, and functional complexity are critical.Features:
1.Ultra-fine traces: Line widths/spacings ≤ 0.1mm (even down to 0.03mm), fitting more conductive paths in limited space.
2. Microvias: Tiny holes (≤0.15mm diameter) in blind/buried/stacked designs, connecting layers without wasting surface area.
3. Multi-layer structure: 8–40+ layers (vs. 2–4 for traditional PCBs) to isolate signals/power and integrate complex circuits.
4. High component density: ≥100 components per square inch, enabling mini devices (e.g., smartwatches) with rich functions.
5. Specialized materials: High-Tg FR-4 (heat-resistant), polyimide (flexible), or PTFE (low signal loss) for harsh environments/high frequencies.
6. Strict precision: Tight tolerances (e.g., ±5% line width error, ≤0.01mm layer alignment) to avoid defects in fine structures.
7. Advanced component compatibility: Supports fine-pitch BGA, CSP, and PoP packages, maximizing vertical/horizontal space use.
Technical Parameters:
Thickness | 1.2mm |
Impedance Control | ±10% |
Copper Thickness | 2oz Out Layer, 1oz Inner Layer |
Layer | 12L |
Min. Line Width/Spacing | 0.075mm/0.075mm |
Layer Count | 1-30 |
Min. Order Quantity | 5㎡ |
Board Size | Customized |
Board Thickness | 0.2-5.0mm |
Minimum Via Dia | 0.2mm |
Applications:
The High Density PCB, originating from China, is a cutting-edge product suitable for a wide range of applications across various industries. With its impressive attributes such as ±10% Impedance Control, 0.1mm Min. Hole Size, and 0.075mm Min. Line Width/Spacing, this 12-layer PCB with 8 layer count is designed to meet the demanding requirements of modern technology.
One prominent application scenario for the High Density PCB is in the field of Medical Devices. The precision and reliability offered by this PCB make it ideal for use in medical equipment such as patient monitoring systems, diagnostic devices, and imaging technology. The ±10% Impedance Control ensures stable signal transmission, while the 0.1mm Min. Hole Size allows for intricate designs necessary for medical device miniaturization.
Another key feature of the High Density PCB is its ability to support Stacked Vias and Staggered Vias. This capability opens up a world of possibilities for high-density interconnects in advanced electronic devices. Industries such as telecommunications, aerospace, and automotive can benefit from the increased routing density and signal integrity provided by these vias.
Whether it's creating complex circuitry for aerospace applications, designing innovative telecommunications equipment, or developing high-performance automotive electronics, the High Density PCB proves to be a reliable and versatile choice. Its 0.075mm Min. Line Width/Spacing ensures precise signal routing, while the 12-layer configuration offers ample space for intricate designs.
Customization:
Product Customization Services for the High Density PCB product:
- Brand Name: High Density PCB
- Place Of Origin: China
- Min. Order Quantity: 5㎡
- Testing Service: 100% Testing
- Surface Finish: HASL, ENIG, OSP
- Min Holes: 0.1mm
- Layer: 12L
Keywords: Stacked Vias, Signal Integrity (SI)
FAQ:
Q: What is the brand name of this product?
A: The brand name of this product is High Density PCB.
Q: Where is this product manufactured?
A: This product is manufactured in China.
Q: What are the key features of High Density PCB?
A: High Density PCB offers superior circuit density, precise signal transmission, and enhanced performance.
Q: Can I customize the specifications of High Density PCB?
A: Yes, we provide customization options for High Density PCB to meet your specific requirements.
Q: Is High Density PCB suitable for high-performance electronic devices?
A: Yes, High Density PCB is designed to meet the demands of high-performance electronic devices.