FR4 1.2mm Thinkness High Density PCB Multi Level Design HDI PCB Board

High-density PCB

Advantages of Miniaturization design PCB:

• Miniaturization design
• Improve the circuit integration
• Better electrical performance
• Improve signal integrity
• Reduce costs

product  Description:

   High-density PCB (High-Density PCB) refers to a printed circuit board with higher circuit density, smaller aperture and thinner lines. Compared with traditional PCBs, high-density PCB designs enable more circuit connections in the same space, adapting to the needs of miniaturized, high-performance electronic products. High-density PCB can achieve higher integration and higher functional density by using technologies such as micro-holes, fine lines, and multi-layer structures.

product Features:

• High circuit density
• Fine line design
• Micro via and blind via technology
• Multi-level design
• Higher electrical performance
• Compact size

Manufacturing process:

• Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
• Blind and buried via design: Blind vias are holes that connect the outer and inner layers, while buried vias are holes that connect the layers. The use of these holes can help achieve a more compact layout and higher circuit density.
• High-precision etching: Due to the very small line spacing required by high-density PCBs, high-precision etching processes are needed to manufacture lines. The etching process needs to be very precise to ensure the stability and electrical performance of the fine lines.
• Interlayer connection: High-density PCBs usually use blind vias or buried vias for interlayer connection, and the integrity of signal transmission, antiference ability, and thermal management need to be considered during connection.
• Surface treatment: The surface of high-density PCBs is usually treated with special surface treatment processes such as gold plating, silver plating, OSP ( metal surface treatment), etc., to ensure good solderability and anti-oxidation.
• Precision assembly: The assembly process of high-density PCBs requires extremely high precision, and usually automated equipment is needed for precision welding and assembly to ensure that can be correctly soldered onto the circuit board.