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High Density Interconnect PCB Green Oil Solder Mask Miniaturization Design
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 14-15 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | HDI PCB | Material: | FR4 |
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| Pcba Service: | Yes | Min. Hole Size: | 0.1mm |
| Standard: | IPC-A-610E | Max Board Size: | 528*600mm |
| Surface Finishing: | HASL/OSP/ENIG | Minimum Line Space: | 3mil (0.075mm) |
| Quotation Condition: | Gerber Files Or BOM | PCB Layers: | 2/4/6/8/10 Or Customizable |
| Board Thinkness: | 1.6/1.2/1.0/0.8mm Or Customized | Solder Ink Color: | Green,Red,Blue,White,Yellow,Black |
| Highlight: | 1.2mm High Density Interconnect PCB,Miniaturization Design HDI PCB Board |
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Product Description
High-Density Interconnect PCB
HDI boards utilize advanced manufacturing techniques such as laser-drilled microvias, blind vias, and buried vias to connect different layers without occupying excessive surface area. This design allows for more components to be packed into a compact space, making it ideal for slim, lightweight products like smartphones, tablets, medical devices, and aerospace electronics.
Customized services(PCB or PCBA)
1. Gerber files (RS-274X),PCB thickness, ink color, surface treatment process.
2. BOM (if PCBA or SMT process is needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.
Manufacturing process:
- Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
- Multilayer wiring: HDI PCBs typically employ a multilayer design, connecting different circuit layers through blind and buried vias. Interconnection each layer is achieved through microvias, blind vias, or buried vias, which enhances the density and integration of the circuit board.
- Blind and buried via design: Blind vias are holes that connect only the outer and inner layers, while buried vias are holes that connect the inner layers. The use of these holes can further reduce the volume of the circuit board and increase the wiring density.
- Surface treatment and assembly: The surface treatment of HDI PCBs requires higher precision and reliability. Common surface treatments include gold plating,HSAL, OSP (Organic Metal Surface Treatment), etc. In addition, the assembly process of HDI PCBs usually requires fine welding technology to ensure the close connection between and the circuit board.
- High-precision process: In the manufacturing process of HDI PCB, high-precision etching technology is required to ensure the correct manufacturing of fine lines precision holes. At the same time, it is necessary to precisely control variables such as current density, temperature, and pressure to ensure the consistency and high performance.
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