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Custom Multilayer PCB Manufacturing with Immersion Gold for Wireless Devices
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS,CE,UL,ISO,IATF |
| Model Number: | As Per Customer's Mode |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
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| Price: | Based On Gerber |
| Packaging Details: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | High Density Interconnect PCB | Material: | FR4 |
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| Surface Treatment Process: | ENIG | Testing Method: | Flying Probe Test |
| Feature: | Lightweight | Quality Standard: | IPC Class 2 |
| Quotation List: | Gerber Or BOM List | SMT Technology: | SMD, BGA, DIP, Etc. |
| Quotation: | Based On Gerber Files | Soldermask: | Green/ White/ Black/ Blue/ Yellow/Red |
| Highlight: | lightweight UAV PCB board,green soldermask electronic board,optimized design UAV PCB |
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Product Description
Custom ENIG finish HDI PCB:
ENIG HDI PCB combines high-density interconnect technology with a premium immersion gold finish. It offers excellent flatness, stable impedance control, and strong corrosion resistance, making it perfect for high-frequency and miniaturized electronic devices.
Why Choose Us?:
✔ 30 Years Expertise in PCB Manufacturing
✔ ISO 9001, ROHS, and ISO /TS16949 Certified
✔ Support customized services
✔ Professional Engineering Support (DFM, impedance simulation)
✔ Global Shipping (DHL, FedEx, UPS) – Delivered to USA, Germany, UK, Japan, Australia, etc.
HDI PCB Advantages :
• Miniaturization: By using microvias and fine-line features, HDI allows more components to be packed into a significantly smaller footprint.
• Enhanced Signal Integrity: Shorter interconnection paths reduce signal loss and parasitic interference, making them ideal for high-speed devices.
• Superior Reliability: Stacked and filled vias provide a robust physical structure, enhancing thermal management and electrical performance.
• Cost Efficiency: While the technology is advanced, reducing the number of layers and overall board size can lower total material costs.
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