Custom Size Double Sided Tin Plated PCB HASL Treatment Printed Circuit Board

Double-sided tin-plated PCB, headphone board ear plate

product  Description:

    Double-sided hot air solder leveling (HASL) PCB is a type of printed circuit board where both sides of the substrate are treated with the hot air solder leveling process, featuring practical performance and wide adaptability. Its core characteristics are as follows:​ The surface treatment involves uniformly covering the copper surface with molten tin-lead alloy (or lead-free tin alloy), which is then leveled by hot air to form a flat, bright tin layer with moderate thickness and strong adhesion. This process endows the board with excellent solderability, ensuring good wetting of the solder during component welding, reducing the risk of cold solder joints. Moreover, the tin layer allows for multiple rework soldering, making it suitable for mass assembly and later maintenance needs.​ Meanwhile, the tin layer has certain oxidation resistance and protective capabilities, which can protect the copper surface from environmental corrosion, extend the storage and service life of the board, and is particularly suitable for general industrial environments such as humid and dusty conditions.​ In terms of structure, the double-sided design provides basic double-sided wiring space, meeting the signal transmission requirements of small and medium complexity circuits. Additionally, the hot air solder leveling process is mature and stable, with high production efficiency and controllable costs. It is widely used in consumer electronics, home appliances, industrial control and other fields that require a balance between welding reliability and economy.

Core Characteristics:

• Dual-sided HASL treatment: Both sides of the substrate are coated with a molten tin-lead or lead-free tin alloy layer, which is leveled by hot air to form a flat, bright tin coating with moderate thickness and strong adhesion to the copper surface.
• Dual-layer wiring structure: Basic double-sided wiring space supports signal transmission for small to medium complexity circuits, meeting standard electronic design needs.

Key Advantages​:

• Superior solderability: The tin layer ensures excellent wetting of solder during component welding, minimizing cold solder joints. It allows multiple rework soldering, adapting to mass assembly and post-maintenance requirements.
• Reliable protection: The tin coating provides oxidation resistance and corrosion protection for the copper surface, extending the board’s storage and service life, especially in general industrial environments (e.g., humid, dusty conditions).
• Practical efficiency: The mature and stable HASL process enables high production efficiency and controllable costs, making it a cost-effective choice for fields like consumer electronics, home appliances, and industrial control where a balance of welding reliability and economy is required.