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Red Oil Double Sided PCB Board OSP Surface Treatment 0.4mm Thickness
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
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Detail Information |
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| Mini Holes: | 0.1mm | Special Tech: | Impendance Control |
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| Special Requirement: | 25um Hole Copper | Delievery Time: | 3 -5 Days After Receive The Payment |
| Impedance Control: | YES | Wire Inlet: | Right Angle Wire Inlet |
| Finished Copper Thickness: | 1/1OZ | Treatment Finished: | Immersion Gold |
| Thickness: | 0.4mm | Finished Copper: | 35um |
| Pcb Base Material: | FR4 TG150 | Peelable Mask: | No |
| Pcb Thickness: | 1.6mm | Minconductivewidth: | 0.2mm |
| Min. Trace/Spacing: | 3mil | ||
| Highlight: | Red Oil Double Sided PCB Board,0.4mm Thickness Double Sided PCB Board,Double Sided PCB Board OSP Surface |
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Product Description
Red oil OSP double-sided board PCB
Product Description
Red oil OSP double-sided board PCB is a double-sided printed circuit board that integrates red solder mask and OSP (Organic Solderability Preservative) surface treatment. It features a double-sided wiring design with a standard FR-4 substrate. The board is coated with red ink as the solder mask, which provides insulation, protects the circuit, and offers high-visibility visual identification due to its vivid color. Exposed copper pads on both sides undergo OSP treatment, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for small to medium complexity circuits, adapting to the welding needs of conventional and precision components like SMT in general operating environments.
Core Characteristics
- Red oil solder mask + OSP treatment + double-sided structure: The red ink ensures stable insulation, striking visual distinction for circuit areas, and a distinct appearance; the ultra-thin (0.1-0.3μm) OSP film guarantees oxidation resistance and reliable solderability; the double-sided design supports bidirectional signal transmission.
- Layered functionality: Red solder mask isolates non-welding areas, while OSP-treated pads enable secure component bonding, with both working in tandem to maintain circuit integrity.
- Process compatibility: The combination of red ink solder mask and OSP treatment is stable, with good material compatibility, fitting seamlessly into standard production workflows.
Main Advantages
- High-visibility identification: The bright red solder mask simplifies circuit inspection, fault diagnosis, and assembly verification, reducing human error in production and maintenance processes.
- Reliable solderability: The OSP film is easily removed during soldering, ensuring excellent solder wetting on copper surfaces, minimizing cold solder joints, and adapting to fine-pitch components like QFP.
- Effective protection: The red ink solder mask isolates the circuit from moisture, dust, and physical abrasion, while the OSP film prevents copper oxidation, extending the board’s storage and service life.
- Cost-effectiveness: The low-cost OSP process combined with economical red ink and standard double-sided substrate results in controllable production costs, suitable for cost-sensitive applications in consumer electronics and home appliances.
- Environmental friendliness: The OSP process uses non-toxic organic compounds, and red ink is typically eco-friendly, complying with environmental regulations and reducing hazardous waste.
- Dimensional precision: The thin OSP layer and red ink do not significantly alter the board’s thickness or flatness, maintaining precision for high-density double-sided circuit designs.
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