 |
Black Oil Dual Sided PCB Board OSP Process Printed Circuit Board Customized Size
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
|---|---|
| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
|
Detail Information |
|||
| Cu Thickness: | 2/2oz | Min. Trace/Spacing: | 0.1 Mm |
|---|---|---|---|
| Conductor Space: | 3 Mil | Count: | 6LAYER |
| Material Supplier: | King Board | Peelable: | 0.3-0.5mm |
| Lumen: | 16-18lm Per Led | Mask: | Yellow+green |
| Minholesize: | 0.2mm | Keyword: | Two Sided PCB |
| Pcb Thickness: | 2.0 Mm | Marterial: | FR4 |
| Surface Finishing: | HASL LESD FREE | Thickness: | 1.0mm |
| Highlight: | Black Oil Dual Sided PCB Board,OSP Process Printed Circuit Board |
||
Product Description
Black oil OSP double-sided board PCB
Product Description
Black oil OSP double-sided board PCB is a double-sided printed circuit board that combines OSP (Organic Solderability Preservative) surface treatment with a black solder mask. It features a double-sided wiring design: the substrate (typically standard FR-4) is coated with black ink as the solder mask, which provides insulation, protects the circuit, and offers good light-shielding properties. Both sides of the board undergo OSP treatment on exposed copper surfaces, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for small to medium complexity circuits and adapts to the welding needs of conventional and precision components in general operating environments.
Core Characteristics
- OSP treatment + black oil solder mask combination: The ultra-thin (0.1-0.3μm) OSP film ensures oxidation resistance and solderability on copper surfaces; the black ink provides stable insulation, excellent light-shielding, and a professional appearance.
- Double-sided structure: Supports bidirectional signal transmission, meeting the layout requirements of standard electronic devices and small to medium-scale circuit design needs.
- Good compatibility: The OSP process, standard substrate, and black solder mask ink work well together, integrating smoothly into conventional production processes.
Main Advantages
- Reliable solderability: The OSP film is easily removed during soldering, enabling good solder wetting on copper surfaces, reducing cold solder joint risks, and ensuring stable connections even for fine-pitch components.
- Superior light-shielding and protection: The black solder mask provides effective light-shielding, preventing light interference in sensitive circuits; it also isolates circuits from external environments, enhancing corrosion and abrasion resistance.
- Cost-effectiveness: Combining the low-cost OSP process with economical black ink and standard substrates, the PCB has controllable production costs, suitable for cost-sensitive fields like consumer electronics and home appliances.
- Environmental friendliness: The OSP process uses non-toxic organic compounds, and the black ink is generally environmentally friendly, complying with environmental regulations and reducing hazardous waste.
- Dimensional precision: The thin OSP layer and black ink do not significantly affect the board’s thickness or flatness, making it suitable for high-density circuit designs requiring precise dimensions.
Want to Know more details about this product
