• Blue Oil OSP Process Double Sided PCB Board Higher Circuit Density 1.2mm Thinkness
Blue Oil OSP Process Double Sided PCB Board Higher Circuit Density 1.2mm Thinkness

Blue Oil OSP Process Double Sided PCB Board Higher Circuit Density 1.2mm Thinkness

Product Details:

Place of Origin: China
Brand Name: xingqiang
Certification: ROHS, CE
Model Number: Varies by goods condition

Payment & Shipping Terms:

Minimum Order Quantity: 5 square meters
Price: NA
Delivery Time: 7-10 work days
Payment Terms: ,T/T,Western Union
Supply Ability: 3000
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Detail Information

Min. Solder Mask Clearance: 0.1mm Pcba Standard: IPC-A-610E
Aspect Ratio: 20:1 Board Thinkness: 1.2mm
Minimum Line Space: 3mil (0.075mm) Surface Finishing: HASL/OSP/ENIG
Materila: FR4 Product: Print Circuit Board
Highlight:

OSP Process Double Sided PCB

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Blue Oil Double Sided PCB Board

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Higher Circuit Density Double Sided PCB

Product Description

 Double-sided blue oil OSP process


Advantages of Double-sided PCB:

  • Increase the wiring space
  • The cost is relatively low 
  • Good electrical performance
  • Adapt to high integration requirements


product  Description:

     Double-sided blue oil OSP process, also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional density of the circuit board, allowing it to implement more circuit connections in a relatively small area.



product Features:

  • Two-sided wiring
  • Through hole connection
  • Component placement
  • Higher circuit density


Manufacturing process:

  • Drilling and electroplating: Drilling is carried out according to the design requirements, and electroplating is performed after drilling to form a via the circuits on both sides.
  • Etching: Remove the excess copper foil to form the desired circuit pattern.
  • Assembly and welding: After the components are installed, welding treatment is carried out, which can be done using surface-mount technology (SMT) or through technology (THT).


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