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HDI Printed Board Delivering Electrical Connections And Miniaturized Layouts
Product Details:
| Brand Name: | Xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies By Goods Condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
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| Price: | NA |
| Packaging Details: | Packed As Per Customer |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product Name: | High Density Interconnect PCB | Minimum Line Space: | 3mil (0.075mm) |
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| Material: | FR4 | PCB Layers: | 2/4/6/8/10L |
| PCBA Customization: | Suppport | Surface Finishing: | HASL/OSP/ENIG |
| PCB Standard: | IPC-A-610 E Class II | SMT: | SMD, BGA, DIP, Etc. |
| Quotation Info: | Gerber Or BOM List | Board Thinkness: | 1.2/1.6/1.0/0.8mm Or Customized |
| Highlight: | HDI PCB with miniaturized layouts,High Density Interconnect PCB for electrical connections,HDI printed circuit board with warranty |
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Product Description
High-Performance HDI PCBs for Modern Electronics:
This product incorporates Microvias, Blind Vias, and Buried Vias, ensuring efficient and precise interconnections within the multilayer structure. These via types play a crucial role in enhancing the overall functionality and reliability of the board by minimizing signal loss and crosstalk, which are critical factors in high-speed and high-frequency circuits.The High Density Interconnect PCB is manufactured using high-quality FR4 material, renowned for its excellent mechanical strength, thermal stability, and electrical insulation properties. FR4 is a widely accepted standard in the printed circuit board industry, making this High Density Interconnection Board not only durable but also cost-effective. The choice of material ensures that the board can withstand harsh environmental conditions while maintaining optimal performance, making it suitable for applications in telecommunications, aerospace, medical devices, and consumer electronics.
Main Features:
| Feature Category | Key Characteristics (HDI PCB) |
| Design & Structure | Microvias, high layer count integration, dense component placement, thin substrate |
| Performance | Low signal loss, high-speed transmission support, excellent thermal conductivity, stable impedance |
| Manufacturing Process | Laser drilling, sequential lamination, precise registration control, advanced plating tech |
| Application Advantages | Miniaturization enablement, weight reduction, enhanced reliability for compact electronics |
| Technical Specifications | Fine line width/spacing (≤3mil/3mil), microvia diameter (≤0.15mm), high aspect ratio capability |
Applications:
1.Consumer Electronics: Smartphones, tablets, laptops, smartwatches, TWS earbuds, cameras, game consoles.
2.Communication Devices: 5G base stations, routers, switches, optical modules, satellite communication equipment, IoT gateways.
3.Automotive Electronics: Car navigation systems, autonomous driving sensors (radar/cameras), infotainment systems, EV BMS.
4.Medical Devices: Portable blood glucose meters, ECG machines, ultrasound scanners, wearable medical devices, patient monitors.
5.Industrial Electronics: Industrial robots, PLCs, sensor modules, automated control equipment.Aerospace: Satellite payloads, avionics control systems, UAV core components.
6.Other High-End Gear: AR/VR devices, high-end servers, SSDs, laser printer core modules.
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