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Customizable FR4 Material HDI Multilayer PCB High Density Interconnect PCB Board
Product Details:
| Brand Name: | High Density PCB |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Min. Hole Size: | 0.1mm | Pcba Standard: | IPC-A-610E |
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| Min. Order Quantity: | 1piece | Material: | FR4 |
| Layer: | 1-30 | Board Size: | 600X100mm |
| Board Thickness: | 1.2mm | Impedance Control: | ±10% |
| Highlight: | FR4 Material High Density Interconnect PCB,FR4 Material HDI Multilayer PCB,High Density Interconnect PCB 600X100mm |
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Product Description
Product Description:
Why Choose HDI?HDI technology enables next-generation electronics by breaking space constraints while boosting electrical performance. As devices evolve toward smaller form factors with higher functionality, HDI PCBs provide the essential foundation for innovation in 5G, AI, IoT, and portable medical systems.
Performance Advantages:
- Miniaturization: 50-70% size/weight reduction vs. conventional PCBs.
- Enhanced Signal Integrity: Shorter paths reduce inductance/crosstalk (critical for >5 GHz).
- Improved Thermal Management: Dense thermal vias under BGAs.
- Higher Reliability: Filled micro-vias resist thermal stress (IPC-7093).
- Design Flexibility: Supports complex ICs (0.35mm-pitch BGAs, SiPs).
Structural Configurations (Common Types)
| Type | Structure | Typical Applications |
|---|---|---|
| 1-N-1 | 1 HDI layer sequence | Wearables, Basic IoT |
| 2-N-2 | 2 HDI layers per side | Smartphones, Tablets |
| Any-layer | Micro-vias on all layers | High-end CPUs, GPUs, 5G Modules |
| ELIC | Every Layer Interconnect | Aerospace, Medical Implants |
Key Application Scenarios:
1. Consumer Electronics: Smartphones, tablets, laptops, TWS earbuds, smartwatches, AR/VR headsets, drones.
2. Automotive Electronics: ADAS, battery management systems (BMS), in-vehicle infotainment, central control screens.
3. Medical Devices : Pacemakers, hearing aids, handheld ultrasound devices, endoscopes.
4. Telecom & High-Performance Computing: 5G base stations, high-speed routers, data center servers, AI accelerators.
5. Aerospace & Military Electronics: Radar systems, avionics, satellite modules, missile guidance equipment.
FAQ:
Q: What is the brand name of this PCB product?
A: The brand name of this PCB product is High Density PCB.
Q: Where is this PCB product manufactured?
A: This PCB product is manufactured in China.
Q: What makes the High Density PCB unique?
A: The High Density PCB is known for its compact design and ability to accommodate a high number of components within a small area.
Q: Are the High Density PCBs suitable for high-performance electronic devices?
A: Yes, the High Density PCBs are ideal for high-performance electronic devices due to their excellent signal integrity and reliability.
Q: Can the High Density PCBs be customized to specific requirements?
A: Yes, the High Density PCBs can be customized to meet specific requirements such as size, number of layers, and material composition.
