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Blue Oil Double Sided Printed Circuit Board 1.6mm Thick FR4 PCB Board OSP Surface
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
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Detail Information |
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| Pcb Board Thickness: | 1.0mm | Rohs Compliant: | Yes |
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| Pcb Thickness: | 1.6mm | Special Tech: | Impendance Control |
| Min. Solder Mask Bridge: | 0.1mm | Surface: | OSP |
| Materia: | FR4/FR1/CEM-1/CEM-2/Metal Core | Voltage: | 12 V Or 24 V |
| Fob Price: | US $ 10-30/ Piece | Type: | Customized Electronics |
| Solder Mask Color: | Green | Layers: | Double |
| Material: | FR4 | Number Of Contacts: | 4*2P - 20*2P |
| Highlight: | Double Sided Printed Circuit Board 1.6mm,Double Sided FR4 PCB Board,Blue Oil FR4 Printed Circuit Board |
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Product Description
OSP blue oil double panel
Product Description
OSP blue oil double panel is a double-sided printed circuit board that combines OSP (Organic Solderability Preservative) surface treatment with a blue solder mask. It features a double-sided wiring design: the substrate is coated with blue ink as the solder mask, which provides insulation, protects the circuit, and allows for clear visual identification of circuit areas due to its distinct color. Both sides of the board undergo OSP treatment on exposed copper surfaces, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This panel is suitable for small to medium complexity circuits and adapts to the welding needs of conventional and precision components.
Core Characteristics
- OSP treatment + blue oil solder mask combination: The ultra-thin (0.1-0.3μm) OSP film ensures oxidation resistance and solderability on copper surfaces, while the blue ink offers stable insulation and clear visual differentiation of circuits.
- Double-sided structure: Supports bidirectional signal transmission, meeting the layout requirements of standard electronic devices and small to medium-scale circuit design needs.
- Good compatibility: The OSP process works well with blue solder mask ink and standard substrates (such as FR-4), integrating smoothly into conventional production processes.
Main Advantages
- Reliable solderability: The OSP film is easily removed during soldering, enabling good solder wetting on copper surfaces, reducing cold solder joint risks, and ensuring stable connections even for fine-pitch components.
- Clear identification and protection: The blue solder mask simplifies production inspection and fault diagnosis through visual distinction; it also isolates circuits from external environments, enhancing overall protection.
- Cost-effectiveness: Combining the low-cost OSP process with economical blue ink, the panel has controllable production costs, suitable for cost-sensitive fields like consumer electronics and home appliances.
- Environmental friendliness: The OSP process uses non-toxic organic compounds, and the blue ink is generally environmentally friendly, aligning with environmental regulations and reducing hazardous waste.
- Dimensional precision: The thin OSP layer and blue ink do not significantly affect the board’s thickness or flatness, making it suitable for high-density circuit designs and applications requiring precise dimensions.
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