PCB production line production specifications

PCB Production Line – Production Specifications

A modern PCB production line integrates multiple processes to ensure high precision, efficiency, and reliability. Below are the common specifications and standards:

1. Production Capacity

• Layer count: 1–20 layers (typical), up to 40+ layers for advanced applications
• Board thickness: 0.2 mm – 5.0 mm
• Copper overall: 0.5 oz – 5 oz (customizable)
• Maximum panel size: 528 × 600 mm (varies by equipment)
• Monthly output: Depending on plant, often 60,000 – 80,000 m²

2. Process Capabilities

• Minimum line width/spacing: 3 mils / 3 mils (0.075 mm) or finer with HDI technology
• Minimum drill hole size: 0.1 mm (mechanical drill)
• Aspect ratio (board thickness to hole size): Up to 20:1
• Surface finishes available: HASL (lead / lead-free), ENIG, OSP, Hard/Soft Gold

3. Types of PCBs Produced

• Single-sided
• Double-sided
• Multilayer (up to 20+ layers)
• Rigid PCBs
• Flexible PCBs (FPC)
• Rigid-Flex PCBs
• HDI (High Density Interconnect) boards

4. Quality & Reliability Standards

• Standards compliance: IPC Class 2 / Class 3, UL, ISO 9001, ISO 14001, IATF 16949 (automotive)
• Electrical testing: 100% E-test for all boards
• Solder mask registration: ± 50 μm
• Impedance control tolerance: ± 10%

5. Applications

PCBs manufactured through these specifications are widely used in:

• Telecommunications & networking
• Consumer electronics
• Automotive electronics
• Medical equipment
• Industrial controls
• Aerospace and defense