PCB Production Line – Production Specifications

A modern PCB production line integrates multiple processes to ensure high precision, efficiency, and reliability. Below are the common specifications and standards:

1. Production Capacity

• Layer count: 1–20 layers (typical), up to 40+ layers for advanced applications

• Board thickness: 0.2 mm – 5.0 mm

• Copper overall: 0.2 oz – 5 oz (customizable)

• Maximum panel size: 600 × 1200 mm (varies by equipment)

• Monthly output: Depending on plant, often 50,000 – 80,000 m²

2. Process Capabilities

• Minimum line width/spacing: 3 mils / 3 mils (0.075 mm) or finer with HDI technology

• Minimum drill hole size: 0.15–0.20 mm (mechanical drill), 0.075 mm (laser drill for microvias)

• Aspect ratio (board thickness to hole size): Up to 20:1

• Surface finishes available: HASL (lead / lead-free), ENIG, OSP, Immersion Tin, Immersion Silver, Hard/Soft Gold

3. Types of PCBs Produced

• Single-sided

• Double-sided

• Multilayer (up to 20+ layers)

• Rigid PCBs

• Flexible PCBs (FPC)

• Rigid-Flex PCBs

• HDI (High Density Interconnect) boards

4. Quality & Reliability Standards

• Standards compliance: IPC Class 2 / Class 3, UL, ISO 9001, ISO 14001, IATF 16949 (automotive)

• Electrical testing: 100% E-test for all boards

• Solder mask registration: ± 50 μm

• Impedance control tolerance: ± 10%

5. Applications

PCBs manufactured through these specifications are widely used in:

• Telecommunications & networking

• Consumer electronics

• Automotive electronics

• Medical equipment

• Industrial controls

• Aerospace and defense