Xingqiang’s Dust-Free Standards: Eliminating Particle Risks in Complex HDI and Multi-Layer PCBs

February 15, 2026

Latest company news about Xingqiang’s Dust-Free Standards: Eliminating Particle Risks in Complex HDI and Multi-Layer PCBs

Precision in Every Particle: Why Xingqiang’s Dust-Free Environment Sets the Standard for High-End PCBs

As the "nervous system" of modern electronics, the reliability of a Printed Circuit Board (PCB) hinges on the precision of its manufacturing environment. With 30 years of industry leadership, Xingqiang Circuit Board Technology Co., Ltd. understands that in the era of micro-circuitry, a single speck of dust can spell disaster.

The Market Challenge: Why Cleanliness Matters?

As PCB designs evolve toward HDI and multi-layer complexity, line widths have shrunk to micron levels. Even a 0.5μm particle—invisible to the naked eye—can cause catastrophic short circuits or insulation failure. For our clients in telecommunications, automotive, and medical sectors, "clean enough" is no longer an option.

The Xingqiang Solution: Rigorous Environmental Mastery:

To guarantee 100% reliability for our Double-sided, Multi-layer, and HDI boards, Xingqiang has implemented a multi-tiered Cleanroom system aligned with ISO 14644-1 standards:

  • Core Precision : Our Inner Layer Imaging and LDI (Laser Direct Imaging) zones operate under ultra-high purity to prevent any pattern defects during exposure.
  • Critical Processing: Solder mask printing and AOI (Automated Optical Inspection) areas are strictly controlled to ensure flawless surface finishes and accurate testing.
  • Holistic Control: From high-purity chemical delivery systems to air showers and anti-static (ESD) flooring, we manage every variable—equipment, materials, and personnel behavior—to eliminate contamination at the source.

At Xingqiang, our focus extends beyond PCB fabrication to the core of product reliability. Through rigorous control of environmental purity and ongoing upgrades to our cleanroom standards, we ensure the ultra-clean manufacturing environment required to power tomorrow’s electronic breakthroughs.