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White Oil Sinking Gold Multilayer Rigid Flex PCB Board 4 Layer Printed Circuit Boards 6x2
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
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| Price: | NA |
| Delivery Time: | 15-16 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Solder Mask Color: | Green | Solder Mask Colour: | Black Solder Mask |
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| Layers: | 8 | Outline Tolerance: | ±0.1mm |
| Pcb Standard: | IPC-A-610 D | Application: | Solid State Drive |
| Min. Line Width/Spacing: | 0.075mm | Finished Copper: | 1oz |
| Material: | Polyimide | Package: | Vacuum Package.. |
| Surface Finishing: | Tin | Treatment: | ENIG/OSP/Immersion Gold |
| Panel: | 6*2 | Other Service: | PCB Assembly, Prototype Order |
| Thickness: | 0.1-0.3mm | ||
| Highlight: | Sinking Gold Rigid Flex PCB,Rigid Flex PCB Board 4 Layer,6x2cm Rigid Flex PCB Board |
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Product Description
White oil sinking gold 4-layer soft and hard combination plate PCB
product Description:
The 4-layer gold immersion rigid-flex PCB combines the characteristics of multi-layer structure, gold immersion treatment and rigid-flex design, with the following notable advantages: In terms of structure and design, the 4-layer layout provides sufficient wiring space, enabling reasonable partitioning of power, ground and signal layers to meet the integration needs of medium and high complexity circuits. The rigid-flex feature allows it to ensure overall structural stability through the rigid part, while adapting to narrow and irregular assembly spaces by virtue of the bending and folding ability of the flexible part, reducing the use of connectors and simplifying the assembly process. In terms of performance, the gold layer formed by gold immersion surface treatment is uniform and dense, with excellent oxidation resistance and wear resistance, which can maintain good solderability for a long time, especially suitable for high-frequency plugging or precision welding scenarios. Moreover, the gold layer has good conductivity, which can improve the signal transmission efficiency. In addition, the gold immersion process has high stability, which can ensure the consistency of the surface performance of the board and reduce the production defect rate. Compared with high-order multi-layer boards, the 4-layer structure makes material costs and processing difficulties more controllable under the premise of meeting performance requirements. Combined with mature rigid-flex technology, the production cycle is relatively controllable, making it suitable for mass production. It is widely used in communication equipment, precision instruments, automotive electronics and other fields.
product Features:
- Structural efficiency: 4 layers enable organized power/ground/signal partitioning for mid-high complexity circuits; rigid-flex design balances stability and adaptability to tight spaces, cutting connectors and simplifying assembly.
- Strong performance: Uniform, dense gold layers resist oxidation/wear, ensuring long-term solderability (ideal for high-frequency plugging/precision welding) and boosting signal transmission via good conductivity.
- Production benefits: Stable gold immersion ensures consistent surface quality and low defects; 4-layer structure controls costs/processing difficulty vs. high-order boards, with manageable lead times for mass production, fitting communication, precision instruments, automotive electronics, etc.
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