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Gold Plating Process Double Sided PCB FR4 Material OSP Process Customized Service
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
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Detail Information |
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| Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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| Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
| Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
| Materila: | FR4 | Product: | Print Circuit Board |
| Highlight: | Gold Plating Double Sided FR4 PCB,Two Sided Wiring Printed Circuit Board |
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Product Description
Double-sided gold plating PCB
This type of PCB has a double-sided copper design, with conductive patterns on both sides of the insulating substrate. The gold plating is applied through an electroplating process, providing excellent wear resistance and strong anti-oxidation properties, making it suitable for high-reliability electronic devices. The manufacturing process involves key steps such as cutting, drilling, copper deposition, pattern electroplating, and gold plating, where the gold layer is deposited on the copper foil through a catalytic electroplating process.
Advantages of Double-sided PCB:
- Increase the wiring space
- Improve the circuit functional density
- The cost is relatively low
- Good electrical performance
- Adapt to high integration requirements
Applications:
• Communication equipment
• Automotive electronics
• Other fields
• Computer peripherals
• Medical devices
• Industrial systems
Key Features of Double-Sided PCBs:
- Dual Copper Layers: Conductive copper traces exist on both sides (top & bottom) of the insulating substrate (e.g., FR-4).
- Plated Through-Holes (PTHs): Essential metalized holes electrically connect circuits between the two layers, enabling vertical routing.
- Increased Density & Complexity: Supports significantly more components and traces than single-sided boards by utilizing both surfaces and cross-layer connections via PTHs.
- Design Flexibility: Offers greater routing freedom for complex circuits, overcoming the limitations of single-layer designs.
- Component Mounting: Accommodates both SMD (Surface Mount) and through-hole components on either or both sides of the board.
- Standard Finishes: Typically includes solder mask (insulation/protection) and silkscreen (markings) applied to one or both sides.
Manufacturing process:
→ Copper Cladding (double-sided copper foil on insulating substrate)
→ Drilling (creating holes for interconnections)
→ Plating (electroplating copper to strengthen hole walls)
→ Imaging (transferring circuit patterns to both sides)
→ Etching (removing excess copper to form conductive traces)
→ Solder Mask Application (adding protective coating)
→ Surface Finish (e.g., gold plating for durability) → Silk Screening (adding component labels) → Electrical Testing (verifying conductivity and connections) → Final Inspection and Packaging.
