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Black Oil OSP 4 Layer PCB Printed Circuit Board For Medical Equipment
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | KAZD |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
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Detail Information |
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| Max. Panel Size: | 528x600mm | Surface Finish: | HASL, ENIG, OSP, Immersion Silver |
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| Solder Mask Color: | Green, Blue, Black, Red, Yellow, White | Min. Hole Size: | 0.1mm |
| Silkscreen Color: | White, Black, Yellow | Testing: | 100% E-test |
| Copper Thickness: | 1-3 Oz | Application: | Medical Equipment |
| Min. Trace/Space: | 0.1mm/0.1mm | Board Thickness: | 0.2-5.0mm |
| Material: | FR-4 | Lead Time: | 5-10 Days |
| Layer Count: | 2-8 Layers | ||
| Highlight: | Black Oil OSP 4 Layer PCB,Medical Equipment 4 Layer PCB |
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Product Description
Black oil OSP 4-layer board PCB
Product Description
Black oil OSP 4-layer board PCB is a 4-layer printed circuit board that combines black solder mask, OSP (Organic Solderability Preservative) surface treatment, and a multi-layer wiring structure. The substrate (typically FR-4) consists of four conductive layers, interconnected by plated through-holes to enable complex signal transmission. The board is coated with black ink as the solder mask, providing insulation, circuit protection, and excellent light-shielding properties. Exposed copper pads on all layers undergo OSP treatment, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for medium-complexity circuits, adapting to the welding needs of precision components like SMT and fine-pitch parts in general operating environments.
Core Characteristics
- 4-layer structure + black oil solder mask + OSP treatment: The 4-layer design offers ample wiring space for medium-complexity circuits; the black ink provides stable insulation, strong light-shielding, and a professional appearance; the ultra-thin (0.1-0.3μm) OSP film ensures oxidation resistance and reliable solderability on copper surfaces.
- Interconnected layers: Plated through-holes enable electrical continuity between the four layers, supporting complex signal routing and power distribution.
- Process compatibility: The integration of 4-layer lamination, black oil solder mask, and OSP treatment is stable, with good material compatibility, fitting into standard production workflows.
Main Advantages
- Enhanced wiring capacity: The 4-layer structure allows separate power, ground, and signal layers, reducing crosstalk and improving signal integrity, suitable for medium-complexity circuits in communication devices and industrial control systems.
- Reliable solderability: The OSP film is easily removed during soldering, ensuring good solder wetting on copper surfaces, minimizing cold solder joints, and adapting to precision components like QFP and BGA.
- Superior light-shielding and protection: The black solder mask effectively blocks light interference in sensitive circuits and isolates the board from external environments, boosting corrosion and abrasion resistance.
- Cost-effectiveness: Compared to higher-layer boards, the 4-layer design balances performance and cost; combined with low-cost OSP and economical black ink, it offers controllable production expenses, suitable for cost-sensitive mid-complexity applications.
- Environmental friendliness: The OSP process uses non-toxic organic compounds, and the black ink is generally eco-friendly, complying with environmental regulations and reducing hazardous waste.
- Dimensional precision: The thin OSP layer and black ink do not significantly affect the board’s thickness or flatness, maintaining precision for high-density 4-layer circuit designs.
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