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4L Black Oil OSP and High Temperature Resistance Printed Circuit Board For Medical Equipment
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 80000㎡/Month |
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Detail Information |
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| Surface Finish: | HASL, ENIG, OSP, Immersion Silver | Min. Hole Size: | 0.1mm |
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| Max. Panel Size: | 528x600mm | Silkscreen Color: | White, Black, Yellow |
| Testing: | 100% E-test | Material: | FR-4 |
| Layer Count: | 2-30 Layers | Application: | Medical Equipment |
| Solder Mask Color: | Green, Blue, Black, Red, Yellow, White | ||
| Highlight: | Black Oil OSP 4 Layer PCB,Medical Equipment 4 Layer PCB |
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Product Description
What is Black oil OSP 4-layer board PCB?
Black oil OSP PCB is a printed circuit board that combines black solder mask, OSP (Organic Solderability Preservative) surface treatment, and a multi-layer wiring structure. The substrate (typically FR-4) consists of four conductive layers, interconnected by plated through-holes to enable complex signal transmission. The board is coated with black ink as the solder mask, providing insulation, circuit protection, and excellent light-shielding properties. Exposed copper pads on all layers undergo OSP treatment, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for medium-complexity circuits, adapting to the welding needs of precision components like SMT and fine-pitch parts in general operating environments.
- 4-layer structure + black oil solder mask + OSP treatment: The 4-layer design offers ample wiring space for medium-complexity circuits; the black ink provides stable insulation, strong light-shielding, and a professional appearance; the ultra-thin (0.1-0.3μm) OSP film ensures oxidation resistance and reliable solderability on copper surfaces.
- Interconnected layers: Plated through-holes enable electrical continuity between the four layers, supporting complex signal routing and power distribution.
- Process compatibility: The integration of 4-layer lamination, black oil solder mask, and OSP treatment is stable, with good material compatibility, fitting into standard production workflows.
- Enhanced wiring capacity: The 4-layer structure allows separate power, ground, and signal layers, reducing crosstalk and improving signal integrity, suitable for medium-complexity circuits in communication devices and industrial control systems.
- Reliable solderability: The OSP film is easily removed during soldering, ensuring good solder wetting on copper surfaces, minimizing cold solder joints, and adapting to precision components like QFP and BGA.
- Superior light-shielding and protection: The black solder mask effectively blocks light interference in sensitive circuits and isolates the board from external environments, boosting corrosion and abrasion resistance.
- Cost-effectiveness: Compared to higher-layer boards, the 4-layer design balances performance and cost; combined with low-cost OSP and economical black ink, it offers controllable production expenses, suitable for cost-sensitive mid-complexity applications.
- Environmental friendliness: The OSP process uses non-toxic organic compounds, and the black ink is generally eco-friendly, complying with environmental regulations and reducing hazardous waste.
- Dimensional precision: The thin OSP layer and black ink do not significantly affect the board’s thickness or flatness, maintaining precision for high-density 4-layer circuit designs.
Core Challenges in Manufacturing Medical-grade PCBs
1. Material Selection & Biocompatibility
Requirement: Medical-grade substrates (e.g., polyimide, ceramic) must endure sterilization (121°C autoclaving) and avoid toxicity.
Challenge: High-cost materials, scarce supply chains, and complex ISO 10993 biocompatibility certification.
2. Ultra-High Precision & Miniaturization
Requirement: ≤75μm trace width/spacing, micro-vias (≤100μm), and HDI stacking for implants.
Challenge: Low yield from laser drilling/etching defects, requiring nano-scale equipment and Class 1000 cleanrooms.
3. Extreme Environment Reliability
Requirement: 10+ years of zero failure under -40°C to 150°C, 95% RH, or chemical exposure.
Challenge: Demanding protective processes (conformal coating, filled vias) and rigorous IEC 60601 testing.
4. EMI/EMC Control & Signal Integrity
Requirement: >100dB noise immunity (e.g., ECG machines) via shielding and optimized grounding.
Challenge: High-cost multilayer design/validation to meet EN 55011 standards.
5. Full Regulatory Compliance & Traceability
Requirement: ISO 13485 compliance, full material/process traceability, and FDA/MDR documentation.
Challenge: >12-month certification cycles and high recall risks for defects.
