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HASL Lead Free Rigid Flex PCB 4 Layer Blank Printed Circuit Board For Electronic Systems
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 square meters |
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| Price: | NA |
| Delivery Time: | 15-16 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
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Detail Information |
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| Min. Solder Mask Clearance: | 0.1mm | Pcba Standard: | IPC-A-610E |
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| Aspect Ratio: | 20:1 | Board Thinkness: | 1.2mm |
| Minimum Line Space: | 3mil (0.075mm) | Surface Finishing: | HASL/OSP/ENIG |
| Materila: | FR4 | Product: | Print Circuit Board |
| Highlight: | HASL Lead Free Rigid Flex PCB,4 Layer Blank Printed Circuit Board,Printed Circuit Board For Electronic Systems |
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Product Description
4-layer HASL rigid-flex PCB
product Description:
The 4-layer lead-free HASL (Hot Air Solder Leveling) flex-rigid PCB merges structural adaptability with robust solder performance, engineered for reliable operation in demanding electronic systems.Constructed with a 4-layer configuration, it integrates rigid FR-4 substrates for mechanical robustness and flexible polyimide (PI) layers for superior bending capability, enabling seamless 3D integration in compact assemblies. Its standout feature is the lead-free HAL surface finish—a RoHS-compliant process that deposits a uniform tin-lead alloy (or tin-silver-copper for lead-free variants) via hot air leveling, ensuring excellent solderability, enhanced wear resistance, and strong adhesion to copper traces..
product Features:
- Rigidity and flexibility combined
- Space saving
- High-density wiring
- Good seismic and anti-interference performance
- Improve the reliability of the system
- Design flexibility
Manufacturing process:
- The 4-layer lead-free HASL (Hot Air Solder Leveling) flex-rigid PCB merges structural adaptability with robust solder performance, engineered for reliable operation in demanding electronic systems.
- PCB lamination: The manufacturing of rigid-flex PCBs requires the lamination of rigid and flexible parts, which usually involves precise hot pressing and bonding to combine different material circuit layers into a complete PCB.
- Etching and hole processing: Photolithography and etching are performed on the laminated PCB to form the desired circuit pattern, and hole processing is out for component mounting and interconnection between different circuit layers.
- Surface treatment: Surface treatment processes (such as gold plating, tin plating, OSP, etc.) are used to protect the surface of the circuit, ensuring its good solderability and anti-oxidation capability.
- Assembly and testing: After completing the circuit board, perform component placement or plug-in welding, and conduct electrical testing to ensure that the circuit functions normally and the design requirements.
