4 Layer High Density Interconnect Flexible PCB Miniaturization Design Customized

4-layer HDI flexible  PCB

Product  Description:

   4-layer HDI flexible PCB  is a PCB that achieves higher circuit density by using thinner lines, smaller apertures and denser wiring design. This PCB technology can achieve more circuit connections in a limited space by adopting more advanced manufacturing processes and design technologies, and is widely used in mobile phones, tablets, computers, equipment, automobiles, electronics and other medical fields.

Product Features:

• High-density interconnection
• Micro via
• Blind and buried hole design
• Multi-level design
• Fine lines and fine pitch
• Excellent electrical performance
•  Highly integrated

The main manufacturing challenges of HDI circuit boards

• Microvia processing requires laser drilling and precise plating to ensure reliable connections
• Multilayer registration demands micron-level alignment accuracy
• Fine line fabrication needs special processes to create lines as narrow as 0.076mm
• Signal integrity must be maintained through careful design and simulation
• Quality inspection relies heavily on X-ray and automated optical equipment

Advantages of High-Density Interconnect (HDI) Flexible Printed Circuit Boards (FPC):

1. Miniaturization and Lightweight:

   • HDI technology utilizes microvias, finer lines and spaces, and higher wiring density, significantly reducing the board size and layer count, enabling higher component density.

   • Flexible materials inherently contribute to a lightweight design, essential for compact electronic devices.

2. Superior Electrical Performance:

   • Features shorter signal paths which minimize signal loss, crosstalk, and delays, thereby improving signal integrity for high-speed and high-frequency applications.

   • Microvias have lower parasitic capacitance and inductance, contributing to better signal quality.

3. High Reliability and Durability:

   • The flexible nature allows the circuits to withstand bending, vibration, and shock, enhancing reliability in dynamic or harsh operating environments.

   • The structure and smaller aspect ratio of microvias also contribute to increased board reliability.

4. Space Utilization and 3D Design:

   • FPCs can be bent and folded to conform to irregular product shapes or fit into confined spaces, facilitating three-dimensional interconnections.

   • They can replace multiple connectors and wire harnesses, simplifying assembly and improving overall reliability.

5. Long-Term Cost-Effectiveness:

   • While initial manufacturing costs may be higher, the ability to reduce the number of layers, simplify assembly (by eliminating connectors/cables), and enhance overall product reliability leads to significant long-term system cost savings.

FAQ of HDI PCB

Q: What is the brand name of this product? 

A: The brand name of this product is High Density Interconnect  Flexible PCB.

Q: Where is this product manufactured?

A: This product is manufactured in China.

Q: What is the delivery time for this product?

A: The delivery time of the products varies according to the complexity of PCB manufacturing process.

Q: What are the payment terms for purchasing this product?

A: The payment terms for this product are T/T.

Q: What is the supply ability of this product?

A: The supply ability of this product is 3000㎡.