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Custom HDI PCB Manufacturing Impedance Control, Rogers/FR4 Material for Medical Devices
Product Details:
| Brand Name: | Xingqiang |
| Certification: | ISO 9001 / ROHS /UL / IATF 16949 (automotive) |
| Model Number: | As Per Customer's Model |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
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| Price: | Based On Gerber Files |
| Packaging Details: | Packed As Per Customer |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Product: | Custom Multilayer PCB | Layer Count: | 1-30L |
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| MinimumLineWidth: | 3 Mil | Pcba Customization: | Suppport |
| Outline Tolerance: | +/-0.1mm | Pcba Standard: | IPC-Class 2 |
| Pcb Dimension: | Customizable | Special Board Thinkness: | 2.0/0.6/0.4/0.2mm |
| Price: | Based On Gerber Files | Board Thick: | 1.6/1.2/1.0/0.8mm Or Customized |
| Highlight: | Custom HDI PCB for medical devices,Rogers material HDI PCB manufacturing,FR4 impedance control PCB |
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Product Description
Professional Custom HDI PCB High-Density Circuit Board Manufacturer:
Technical Parameters:
| Product Type | High Density Interconnection Board (HDI PCB) |
| Minimum Line Space | 3 mil (0.076 mm) |
| Minimum Line Width | 3 mil |
| Minimum Hole Size | 0.1 mm |
| Copper Overall | 0.5-5oz |
| PCB Dimension | Customizable |
| Hole Size Tolerance | PTH ±0.075, NTPH ±0.05 |
| Max Board Size | 528*600Mm |
Custom HDI PCB Production Process :
1.Customer File Receipt & Review
Receive Gerber files, BOM, and technical requirements from customers, then conduct a comprehensive DFM (Design for Manufacturability) analysis to ensure manufacturability.
2.Quotation & Order Confirmation
Provide a detailed quotation based on layer count, materials, surface finish, precision, and order quantity. Confirm order details, lead time, and payment terms.
3.Material Preparation
Select and prepare high-quality base materials (FR‑4, high‑TG, high‑frequency, etc.), copper foils, and auxiliary materials according to customer specifications.
4.PCB Fabrication
Carry out inner-layer circuit imaging, etching, AOI inspection, and multilayer lamination. For HDI boards, include laser drilling, microvia formation, and sequential lamination.
5.Plating & Surface Treatment
Perform hole metallization, electroplating, and selected surface finishes such as ENIG, immersion gold, HASL, OSP, or hard gold.
6.Precision Machining
Conduct routing, drilling, gold finger beveling, and silk-screen printing according to custom dimensions and design requirements.
7.Electrical & Performance Testing
Implement electrical testing, impedance testing, high-voltage testing, and reliability inspection to ensure compliance with IPC standards.
8.PCB Assembly (Optional)
Provide one-stop SMT/DIP assembly, component soldering, BOM sourcing, and finished product functional testing.
9.Final Inspection & Packaging
Conduct final visual and quality inspection before vacuum packaging to avoid damage during transportation.
10.Shipment & After-Sales Support
Arrange delivery according to customer requirements and provide after-sales technical support and file archiving.
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