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Custom PCB Assembly with White Solder Mask Color and 0.1mm Min. Hole Size
Product Details:
| Brand Name: | Xingqiang |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Model Number: | As Per Customer's Model |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
|---|---|
| Price: | Based on BOM List |
| Packaging Details: | As Customer Requirements |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| PCB Type: | Custom PCBA | Min. Hole Size: | 0.1mm |
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| Min Line Spacing: | 3Mil | Material: | FR-4 |
| Copper Overall: | 0.5-5oz | Test: | 100% Test |
| Quotation Request: | BOM List | Pcb Layer: | 1-30 Layers |
| Dimension: | Customized | Surface Finish: | HASL, ENIG, OSP |
| Pcb Standard: | IPC-A-610 E Class II | Solder Mask: | Red,Green,Yellow,White,Black,Blue |
| Highlight: | Custom PCB assembly white solder mask,Custom PCB assembly 0.1mm hole size,Custom PCB assembly with warranty |
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Product Description
High temperature resistant assembly circuit board:
PCBA, short for Printed Circuit Board Assembly, refers to the process of mounting and soldering electronic components—such as resistors, capacitors, chips, and connectors—onto a printed circuit board (PCB). This assembly transforms a bare PCB into a functional electronic unit, enabling devices like smartphones, computers, and home appliances to operate efficiently. Essentially, it bridges design and final product manufacturing in electronics.
Main Features:
- Product Name: Custom PCB Assembly
- Solder Mask Color: Green, Red, Blue, Black, White
- Surface Finish: HASL, ENIG, OSP
- Pcb Standard: IPC-A-610 E Class II
- Material: FR-4
- Min. Hole Size: 0.1mm
Major PCBA Manufacturing Challenges:
| Challenge | Description |
| Miniaturization | Handling and placing extremely small (e.g., 01005) or complex (e.g., BGA) components requires ultra-high precision and specialized X-Ray Inspection (AXI). |
| Solder Quality | Controlling solder paste application and the reflow temperature profile to prevent defects like bridging (shorts), tombstoning, and weak joints. |
| Thermal Management | Preventing component overheating by effectively dissipating heat from the densely packed components and managing thermal stress during soldering. |
| Supply Chain | Dealing with component shortages, the risk of counterfeit parts, and the constant need to manage component obsolescence (EOL). |
| DFM Issues | Ensuring the design adheres to manufacturing rules (e.g., sufficient clearance, proper test points) to avoid defects and low yield loss. |
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