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Custom PCB Assembly with White Solder Mask Color and 0.1mm Min. Hole Size
Product Details:
| Brand Name: | Xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies By Goods Condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 Pc(5 Square Meters) |
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| Price: | NA |
| Packaging Details: | As Customer Requirements |
| Payment Terms: | ,T/T,Western Union |
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Detail Information |
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| Type: | PCBA | Pcb Standard: | IPC-A-610 E Class II-III |
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| Pcb Layer: | 2-30 | Min. Hole Size: | 0.1mm |
| Material: | FR-4 | Quotation Request: | Gerber Files,BOM List |
| Surface Finish: | HASL, ENIG, OSP | Test: | 100% Test |
| Highlight: | custom PCB assembly with white solder mask,custom PCB assembly 0.1mm hole size,white solder mask PCB assembly |
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Product Description
High temperature resistant assembly circuit board:
PCBA, short for Printed Circuit Board Assembly, refers to the process of mounting and soldering electronic components—such as resistors, capacitors, chips, and connectors—onto a printed circuit board (PCB). This assembly transforms a bare PCB into a functional electronic unit, enabling devices like smartphones, computers, and home appliances to operate efficiently. Essentially, it bridges design and final product manufacturing in electronics.
Main Features:
- Product Name: Custom PCB Assembly
- Solder Mask Color: Green, Red, Blue, Black, White
- Surface Finish: HASL, ENIG, OSP
- Pcb Standard: IPC-A-610 E Class II-III
- Material: FR-4
- Min. Hole Size: 0.1mm
Major PCBA Manufacturing Challenges:
| Challenge | Description |
| Miniaturization | Handling and placing extremely small (e.g., 01005) or complex (e.g., BGA) components requires ultra-high precision and specialized X-Ray Inspection (AXI). |
| Solder Quality | Controlling solder paste application and the reflow temperature profile to prevent defects like bridging (shorts), tombstoning, and weak joints. |
| Thermal Management | Preventing component overheating by effectively dissipating heat from the densely packed components and managing thermal stress during soldering. |
| Supply Chain | Dealing with component shortages, the risk of counterfeit parts, and the constant need to manage component obsolescence (EOL). |
| DFM Issues | Ensuring the design adheres to manufacturing rules (e.g., sufficient clearance, proper test points) to avoid defects and low yield loss. |
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