Customizable FR4 Material HDI PCB with Thermal Resistance and Space Saving for High-Density Applications
FR4 Material High Density Interconnect PCB
,FR4 Material HDI Multilayer PCB
,High Density Interconnect PCB 600X100mm
HDI technology enables next-generation electronics by breaking space constraints while boosting electrical performance. As devices evolve toward smaller form factors with higher functionality, HDI PCBs provide the essential foundation for innovation in 5G, AI, IoT, and portable medical systems.
- Miniaturization: 50-70% size/weight reduction vs. conventional PCBs
- Enhanced Signal Integrity: Shorter paths reduce inductance/crosstalk (critical for >5 GHz)
- Improved Thermal Management: Dense thermal vias under BGAs
- Higher Reliability: Filled micro-vias resist thermal stress
- Design Flexibility: Supports complex ICs
| Type | Structure | Typical Applications |
|---|---|---|
| 1-N-1 | 1 HDI layer sequence | Wearables, Basic IoT |
| 2-N-2 | 2 HDI layers per side | Smartphones, Tablets |
| Any-layer | Micro-vias on all layers | High-end CPUs, GPUs, 5G Modules |
| Full Layer Interconnect Structure | Every Layer Interconnect | Aerospace, Portable Medical Devices |
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EThe outer packaging was sturdy, and there was no bending or dampness during long-distance transportation.