Through Hole Double Sided PCB Board FR4 Material Two Layer Design OEM Service

FR4 through-hole double-sided board PCB

FR4 through-hole double-sided board PCB, also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional density of the circuit board, allowing it to implement more circuit connections in a relatively small area.

Advantages of Double-sided PCB:

1. Increased Energy Yield: By absorbing direct sunlight on the front and reflected or diffuse light on the rear (e.g., from surfaces like snow, water, or light-colored ground), these panels can boost electricity output by 10-30%, leading to higher overall efficiency and better ROI over time.

2. Enhanced Performance in Diverse Conditions: They excel in environments with high albedo (reflectivity) or low-light scenarios, such as cloudy days or urban settings, ensuring consistent power generation and reducing dependency on ideal weather.

3. Cost-Effectiveness and Space Optimization: With greater energy production per panel, they lower the levelized cost of electricity (LCOE) and allow for more compact installations, making them ideal for space-constrained areas like rooftops or agricultural sites.

4. Durability and Versatility: Featuring robust construction with materials like tempered glass on both sides, they resist degradation and support flexible mounting options (e.g., vertical or elevated setups), adapting to various terrains and applications.

The manufacturing difficulties of through-hole double-sided PCBs

1.Drilling requires high accuracy to create clean, burr-free holes that align perfectly between layers, as misalignment can lead to broken circuits or short circuits.    

2.Via hole metallization demands consistent deposition of conductive copper (typically 20–25μm thick) on hole walls to ensure electrical continuity and withstand thermal stress during soldering; inadequate thickness or voids can cause failures.  

3.Registration control must keep alignment deviations between double-sided graphics and via holes within ±0.075mm to prevent connectivity errors.  

4.Etching and plating processes need tight control over line width/spacing tolerances (±10%) and uniform surface treatment (e.g., HASL, ENIG) to avoid over-etching, residual copper, or poor solderability.