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Blue Oil Double Sided Printed Circuit Board FR4 Subtrate Customized Dimension
Product Details:
| Place of Origin: | China |
| Brand Name: | xingqiang |
| Certification: | ROHS, CE |
| Model Number: | Varies by goods condition |
Payment & Shipping Terms:
| Minimum Order Quantity: | Sample,1 pc(5 square meters) |
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| Price: | NA |
| Delivery Time: | 7-10 work days |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
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Detail Information |
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| Pcb Type: | Double Sided Printed Circuit Board | Rohs Compliant: | Yes |
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| Surface: | OSP | Solder Mask Color: | Green |
| Layers: | 1-30L | Pcb Testing: | 100% E-Test |
| SMT Technology: | SMD, BGA, DIP, Etc. | Type: | Customized Electronics |
| Special Tech: | Impendance Control | Pcb Thickness: | 1.6/1.2/1.0/0.8mm Or Customized |
| Highlight: | Double Sided Printed Circuit Board 1.6mm,Double Sided FR4 PCB Board,Blue Oil FR4 Printed Circuit Board |
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Product Description
OSP Blue Oil Double Sided Printed Circuit Board
OSP blue oil double panel is a double-sided printed circuit board that combines OSP (Organic Solderability Preservative) surface treatment with a blue solder mask. It features a double-sided wiring design: the substrate is coated with blue ink as the solder mask, which provides insulation, protects the circuit, and allows for clear visual identification of circuit areas due to its distinct color. Both sides of the board undergo OSP treatment on exposed copper surfaces, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This panel is suitable for small to medium complexity circuits and adapts to the welding needs of conventional and precision components.
Key Advantages of Anti-Oxidation Blue Solder Mask Double-Sided PCBs
1. Superior Oxidation Resistance:The specialized anti-oxidation coating, combined with the blue solder mask, provides robust protection for copper traces, preventing oxidation and corrosion in humid or harsh environments.
2. Enhanced Visual Contrast:The blue solder mask offers clear contrast against silver or tin surface finishes (e.g., HASL, ENIG) and component labels, simplifying visual inspection, debugging, and manual soldering.
3. Reliable Insulation & Protection:The solder mask effectively insulates copper layers to avoid short circuits, while shielding the board from dust, moisture, and mechanical wear during assembly and operation.
4. Balanced Cost & Performance:As a double-sided structure with a mature blue solder mask process, it maintains cost-effectiveness for medium-volume production, suitable for low-to-medium frequency electronic devices.
1. Superior Oxidation Resistance:The specialized anti-oxidation coating, combined with the blue solder mask, provides robust protection for copper traces, preventing oxidation and corrosion in humid or harsh environments.
2. Enhanced Visual Contrast:The blue solder mask offers clear contrast against silver or tin surface finishes (e.g., HASL, ENIG) and component labels, simplifying visual inspection, debugging, and manual soldering.
3. Reliable Insulation & Protection:The solder mask effectively insulates copper layers to avoid short circuits, while shielding the board from dust, moisture, and mechanical wear during assembly and operation.
4. Balanced Cost & Performance:As a double-sided structure with a mature blue solder mask process, it maintains cost-effectiveness for medium-volume production, suitable for low-to-medium frequency electronic devices.
Main Manufacturing Process of Anti-Oxidation Blue Solder Mask Double-Sided PCBs
1. Substrate Preparation:Cut FR-4 epoxy laminate (the base material) into standard-sized boards, and clean their surfaces to remove dust, oil, or impurities for subsequent copper bonding.
2. Copper Cladding & Patterning:Laminate copper foils onto both sides of the substrate. Then, use photolithography: coat the copper layer with photoresist, expose it to UV light through a circuit mask, and etch away unexposed copper to form the desired circuit traces.
3. Drilling & Plating:Drill through-holes (PTHs) to connect circuits on both sides. Plate the holes with copper via electroplating to ensure electrical conductivity between the top and bottom layers.
4. Blue Solder Mask Application:Screen-print or spray blue solder mask ink onto the board surface. Cure it under UV light to form a protective layer, leaving only pads and holes exposed for soldering.
5. Anti-Oxidation Surface Finishing:Apply an anti-oxidation coating (e.g., chemical treatment or specialized film) on exposed copper pads. Common finishes like HASL (Hot Air Solder Leveling) or ENIG (Electroless Nickel Immersion Gold) are often used to enhance oxidation resistance.
6. Silkscreen Printing & Curing:Print component labels, reference marks, and logos on the blue solder mask layer using white or black ink, then cure it to fix the markings.
7. Electrical & Visual Inspection:Conduct electrical tests (e.g., continuity, insulation resistance) to check circuit functionality. Perform visual inspections to ensure solder mask uniformity, pattern accuracy, and no defects like bubbles or scratches.
8. Final Cutting & Packaging:Cut the multi-panel board into individual PCBs according to design specifications, then clean and package them to prevent damage during transportation.
1. Substrate Preparation:Cut FR-4 epoxy laminate (the base material) into standard-sized boards, and clean their surfaces to remove dust, oil, or impurities for subsequent copper bonding.
2. Copper Cladding & Patterning:Laminate copper foils onto both sides of the substrate. Then, use photolithography: coat the copper layer with photoresist, expose it to UV light through a circuit mask, and etch away unexposed copper to form the desired circuit traces.
3. Drilling & Plating:Drill through-holes (PTHs) to connect circuits on both sides. Plate the holes with copper via electroplating to ensure electrical conductivity between the top and bottom layers.
4. Blue Solder Mask Application:Screen-print or spray blue solder mask ink onto the board surface. Cure it under UV light to form a protective layer, leaving only pads and holes exposed for soldering.
5. Anti-Oxidation Surface Finishing:Apply an anti-oxidation coating (e.g., chemical treatment or specialized film) on exposed copper pads. Common finishes like HASL (Hot Air Solder Leveling) or ENIG (Electroless Nickel Immersion Gold) are often used to enhance oxidation resistance.
6. Silkscreen Printing & Curing:Print component labels, reference marks, and logos on the blue solder mask layer using white or black ink, then cure it to fix the markings.
7. Electrical & Visual Inspection:Conduct electrical tests (e.g., continuity, insulation resistance) to check circuit functionality. Perform visual inspections to ensure solder mask uniformity, pattern accuracy, and no defects like bubbles or scratches.
8. Final Cutting & Packaging:Cut the multi-panel board into individual PCBs according to design specifications, then clean and package them to prevent damage during transportation.
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