FR4 Material Black Oil Drone Circuit Board PCB With ENIG Surface Treatment
Product Details:
Place of Origin: | China. |
Brand Name: | UAV PCB |
Certification: | ROHS,CE |
Model Number: | Varies by goods condition |
Payment & Shipping Terms:
Minimum Order Quantity: | 5 square meters |
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Price: | NA |
Delivery Time: | 15-20 Working Day |
Payment Terms: | T/T,Western Union |
Supply Ability: | 10000㎡ |
Detail Information |
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Min. Hole Size: | 0.1mm | Min. Solder Mask Bridge: | 0.08mm |
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Material: | FR-4 | Copper Thickness: | 0.5-5.0oz |
Silkscreen Color: | White, Black, Yellow | Solder Mask Color: | Green, Red, Blue, Black, White |
Surface Finish: | HASL, ENIG, OSP | Min. Line Width/Spacing: | 3mil |
Max. Panel Size: | 528mm X 600mm | Layer Count: | 2-30 Layers |
Board Thickness: | 0.2-5.0mm | ||
Highlight: | Black Oil Drone Circuit Board,FR4 Material Drone Circuit Board |
Product Description
Black oil Drone Circuit Board
Drone circuit boards are circuit substrates installed in electronic components such as flight control systems, image transmission systems, electronic speed controllers, power distribution modules (PDB), GPS modules, sensors, communication modules, and cameras. They are responsible for functions such as signal processing, power conversion, and communication control.
Structural and Material Characteristics:
- Thickness: Common thickness is 0.8mm ~ 1.6mm.
- Copper thickness: 1oz ~ 3oz, and thickened copper layers are often used in parts such as electronic speed controllers and power distribution.
- Surface treatment: ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling), etc.
- Materials: FR-4 is commonly used, and some high-end applications adopt polyimide (PI) or ceramic substrates to improve shock resistance and high-frequency characteristics.
Features:
- The board is required to be thin and light, and the components are arranged compactly to reduce the total weight of the drone.
- Adapt to the vibration environment during high-speed rotation and flight and outdoor temperature changes.
- Multi-functional modules are integrated into one main board (such as the integration of flight control and PDB), reducing volume and weight.
- Measures such as ground layer separation, filter wiring, and signal impedance control are adopted to reduce electromagnetic interference.
Special Processes:
- HDI (High-Density Interconnect) board technology
- Rigid-flex board (used in foldable arm drones)
- High-frequency and high-speed materials (used for high-frequency signal transmission such as 5.8GHz image transmission and radar waves)
Item | Consumer Drone | Industrial Drone | Military/Special Drone |
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Board material | Ordinary FR-4 | High TG FR-4 / PI | PTFE / Ceramic substrate / Rogers |
Number of layers | 4~8 layers | 6~12 layers | 8~20 layers + HDI + blind and buried vias |
Copper thickness | 1~2oz | 2~3oz | ≥4oz (high-power modules) |
Surface treatment | OSP/Deposit of gold | Immersion Gold/Hot Air Solder Leveling/Anti-sulfurization Process | Immersion Gold/Immersion Silver/Three-proof Coating |
Anti-interference ability | Medium | High | Extremely high (EMI/EMC reinforced design) |
Applicable temperature range | 0~70℃ | -20~85℃ | -40~125℃ or higher |
Communication functions | Bluetooth/WiFi/Image transmission, etc. | 4G/5G/Data transmission/RTK GPS | Encrypted communication/Radar/Electronic countermeasure links |